The intermediate of copper deposition/dissolution in acid bath with PEG and CI

Proceedings - Electrochemical Society

Volumn 11, Issue , 2004, Pages 214-221

  Jin, Ying ^a,b   Kondo, Kazuo ^c   Suzuki, Yosuke ^a   Matsumoto, Toshiaki ^a   Barkey, Dale P ^d  

^a OKAYAMA UNIVERSITY   (Japan)

^b BEIHANG UNIVERSITY   (China)

^c Osaka City University   (Japan)

^d UNIVERSITY OF NEW HAMPSHIRE   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 28844446307     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

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