Effect of the molecular weight of polyethylene glycol as single additive in copper deposition for interconnect metallization

Thin Solid Films

Volumn 516, Issue 15, 2008, Pages 5046-5051

  Ko, Shu Ling ^a   Lin, Jeng Yu ^a   Wang, Yung Yun ^a   Wan, Chi Chao ^a  

^a NATIONAL TSING HUA UNIVERSITY   (Taiwan)

Author keywords

Additive; Interconnect; Polyethylene glycol; Superfilling

Indexed keywords

ADDITIVES; COPPER COMPOUNDS; CYCLIC VOLTAMMETRY; DEPOSITION; ELECTROCHEMISTRY; METALLIZING; MOLECULAR WEIGHT; SCANNING ELECTRON MICROSCOPY;

ACID COPPER SULFATE BATH; CHRONOPOTENTIOMETRY; CURRENT-POTENTIAL RESPONSES; LINEAR SWEEP VOLTAMMETRY;

POLYETHYLENE GLYCOLS;

EID: 42649087405     PISSN: 00406090     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.tsf.2008.02.040     Document Type: Article

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