Surface adsorption of PEG and Cl- additives for copper damascene electrodeposition

Electrochemical and Solid-State Letters

Volumn 8, Issue 1, 2005, Pages

  Jin, Ying ^a   Kondo, Kazuo ^a   Suzuki, Yosuke ^a   Matsumoto, Toshiaki ^a   Barkey, Dale P ^b  

^a OKAYAMA UNIVERSITY   (Japan)

^b University of New Hampshire   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ADDITIVES; ADSORPTION; ATOMIC FORCE MICROSCOPY; ELECTRODEPOSITION; MOLECULAR WEIGHT; QUARTZ; SCANNING ELECTRON MICROSCOPY;

ACID SOLUTION; COPPER DISSOLUTION; NANOGRAMS; SATURATED CALOMEL ELECTRODES (SCE);

POLYETHYLENE GLYCOLS;

EID: 12344249792     PISSN: 10990062     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.1830371     Document Type: Article

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