Inelastic deformation of nanocrystalline Au thin films as a function of temperature and strain rate

Acta Materialia

Volumn 60, Issue 13-14, 2012, Pages 5352-5361

  Karanjgaokar, N J ^a   Oh, C S ^b   Lambros, J ^a   Chasiotis, I ^a  

^a University of Illinois at Urbana Champaign   (United States)

^b Kumoh National Institute of Technology   (South Korea)

Author keywords

Creep; Grain boundary diffusion; Strain rate; Strain rate sensitivity

Indexed keywords

ACTIVATION VOLUME; APPLIED STRAIN; AU THIN FILMS; AVERAGE GRAIN SIZE; DEPINNING; DIFFUSION PROCESS; DISLOCATION CLIMB; GRAIN-BOUNDARY DIFFUSION; HIGH STRAIN RATES; INELASTIC DEFORMATION; MECHANICAL BEHAVIOR; NANOCRYSTALLINES; ROOM TEMPERATURE; STRAIN RATE SENSITIVITY; TEMPERATURE RANGE; THERMALLY ACTIVATED;

ACTIVATION ENERGY; CREEP; GOLD; GRAIN BOUNDARIES; THIN FILMS;

STRAIN RATE;

EID: 84864046005     PISSN: 13596454     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.actamat.2012.06.018     Document Type: Article

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