Microscale Experiments at Elevated Temperatures Evaluated with Digital Image Correlation

Experimental Mechanics

Volumn 51, Issue 4, 2011, Pages 609-618

  Karanjgaokar, N J ^a   Oh, C S ^b   Chasiotis, I ^a  

^a University of Illinois at Urbana Champaign   (United States)

^b Kumoh National Institute of Technology   (South Korea)

Author keywords

Freestanding films; Full field measurements; Infrared imaging; MEMS; Nanocrystalline; Resistive heating; Thin films

Indexed keywords

DIGITAL IMAGE CORRELATIONS; ELEVATED TEMPERATURE; FREESTANDING FILMS; FULL-FIELD MEASUREMENT; FULL-FIELD STRAIN MEASUREMENT; GAUGE LENGTH; HIGH TEMPERATURE GRADIENT; IMAGE CORRELATIONS; MICRO-SCALES; MICROMACHINED; NANOCRYSTALLINES; RESISTIVE HEATING; RESISTIVELY HEATED; SPECIMEN GRIPS; STRAIN FIELDS; STRAIN LOCALIZATIONS; TEMPERATURE FIELD; THIN METAL FILMS; ULTIMATE TENSILE STRENGTH; UNIAXIAL TENSIONS; UNIFORM HEATING;

EXPERIMENTS; GLASS INDUSTRY; HEATING; IMAGE ANALYSIS; IMAGING SYSTEMS; INFRARED DEVICES; METALLIC FILMS; OPTICAL CORRELATION; RATING; STRAIN MEASUREMENT; TEMPERATURE DISTRIBUTION; TENSILE STRENGTH; THERMOGRAPHY (IMAGING); THIN FILMS; INFRARED IMAGING; MEMS;

CONDUCTIVE FILMS; HEATING;

EID: 79953666352     PISSN: 00144851     EISSN: 17412765     Source Type: Journal    
DOI: 10.1007/s11340-010-9439-y     Document Type: Article

References (27)

1. Emery RD, Povirk GL (2003) Tensile behavior of free-standing gold films. Part I Acta Materialia 51(7): 2067-2078.
2. Emery RD, Povirk GL (2003) Tensile behavior of free-standing gold films. Part II Acta Materialia 51(7): 2079-2087.
3. Espinosa HD, Prorok BC (2003) Size effects on the mechanical behavior of gold thin films. J Mater Sci 38(20): 4125-4128.
4. Stanec R, Smith CH III, Chasiotis I, Barker NS (2007) Realization of low-stress Au cantilever beams. J Micromech Microeng 17: N7-N10.
5. Chasiotis I, Bateson C, Timpano K, McCarty A, Barker NS, Stanec J (2007) Strain rate effects on the mechanical behavior of nanocrystalline Au films. Thin Solid Films 515: 3183-3189.
6. Jonnalagadda K, Chasiotis I, Yagnamurthy S, Lambros J, Pulskamp J, Polcawich R, Dubey M (2010) Experimental investigation of strain rate dependence of nanocrystalline Pt films. Exp Mech 50: 25-35.
7. Jonnalagadda K, Karanjgaokar N, Chasiotis I, Chee J, Mahmood A, Peroulis D (2010) Strain rate sensitivity of nanocrystalline Au films at room temperature. Acta Mater 58(14): 4674-4684.
8. Jansen F, MacHonkin MA, Palmieri N, Kuhman D (1987) Thermal expansion and elastic properties of plasma-deposited amorphous silicon and silicon oxide films. Appl Phys Lett 50(16): 1059-1061.
9. Tada H, Kumpel AE, Lathrop RE, Slanina JB, Nieva P, Zavracky P, Miaoulis IN, Wong PY (2000) Thermal expansion coefficient of polycrystalline silicon and silicon dioxide thin films at high temperatures. J Appl Phys 87(9): 4189-4193.
10. Kahn H, Ballarini R, Heuer AH (2002) Thermal expansion of low-pressure chemical vapor deposition polysilicon films. J Mater Res 17(7): 1855-1862.
11. Chae J-H, Lee J-Y, Kang S-W (1999) Measurement of thermal expansion coefficient of poly-Si using microgauge sensors. Sens Actuators, A 75(3): 222-229.
12. Gruber PA, Olliges S, Arzt E, Spolenak R (2008) Temperature dependence of mechanical properties in ultrathin Au films with and without passivation. J Mater Res 23(9): 2406-2419.
13. Volinsky AA, Moody NR, Gerberich WW (2004) Nanoindentation of Au and Pt/Cu thin films at elevated temperatures. J Mater Res 19(9): 2650-2657.
14. Smith JF, Zheng S (2000) High temperature nanoscale mechanical property measurements. Surf Eng 16(2): 143-146.
15. Emery R, Simons C, Mazin B, Povirk GL (1998) High temperature tensile behavior of free-standing gold films. Mater Res Soc Symp Proc 505: 57-62.
16. Oh C-S, Coles G, Sharpe WN Jr (2002) High temperature behavior of polysilicon. Mater Res Soc Symp Proc 741: 53-58.
17. Oh C-S, Sharpe WN Jr (2004) Techniques for measuring thermal expansion and creep of polysilicon. Sens Actuators, A 112(1): 66-73.
18. Zupan M, Hayden MJ, Boehlert CJ, Hemker KJ (2001) Development of high-temperature microsample testing. Exp Mech 41(3): 242-247.
19. Zupan M, Hemker KJ (2001) High temperature microsample tensile testing of γ-TiAl. Mater Sci Eng, A 319-321: 810-814.
20. Haque MA, Saif MTA (2005) Thermo-mechanical properties of nano-scale freestanding aluminum films. Thin Solid Films 484(1-2): 364-368.
21. Kalkman AJ, Verbruggen AH, Janssen GCAM (2003) High-temperature bulge-test setup for mechanical testing of free-standing thin films. Rev Sci Instrum 74(3): 1383-1385.
22. Teh KS, Lin L (1999) Time-dependent buckling phenomena of polysilicon micro beams. Microelectron J 30(11): 1169-1172.
23. Brotzen FR, Rosenmayer CT, Cofer CG, Gale RJ (1990) Creep of thin metallic films. Vacuum 41(4-6): 1287-1290.
24. Hyun S, Brown WL, Vinci RP (2003) Thickness and temperature dependence of stress relaxation in nanoscale aluminum films. Appl Phys Lett 83(21): 4411-4413.
25. Mönig R, Keller RR, Volkert CA (2004) Thermal fatigue testing of thin metal films. Rev Sci Instrum 75(11): 4997-5004.
26. Cho SW, Chasiotis I (2007) Elastic properties and representative volume element of polycrystalline silicon for MEMS. Exp Mech 47(1): 37-49.
27. Kumar KS, Suresh S, Chisholm MF, Horton JA, Wang P (2003) Deformation of electrodeposited nanocrystalline nickel. Acta Mater 51: 387-405.