Nanoindentation of Au and Pt/Cu thin films at elevated temperatures

Journal of Materials Research

Volumn 19, Issue 9, 2004, Pages 2650-2657

  Volinsky, Alex A ^a   Moody, Neville R ^b   Gerberich, William W ^c  

^a University of South Florida   (United States)

^b SANDIA NATIONAL LABORATORIES   (United States)

^c University of Minnesota   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COPPER; ELASTIC MODULI; HARDNESS; INDENTATION; MATHEMATICAL MODELS; NANOSTRUCTURED MATERIALS; OXIDATION; PLATINUM; POLYNOMIALS; THERMAL EFFECTS; THIN FILMS; YIELD STRESS;

ELEVATED TEMPERATURES; NANOINDENTATION; SECOND ORDER POLYNOMIALS;

GOLD;

EID: 6044273860     PISSN: 08842914     EISSN: None     Source Type: Journal    
DOI: 10.1557/JMR.2004.0331     Document Type: Article

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