Characterization of the strain rate dependent behavior of nanocrystalline gold films

Journal of Materials Research

Volumn 23, Issue 1, 2008, Pages 55-65

  Wang, L ^a   Prorok, B C ^a  

^a AUBURN UNIVERSITY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CHARACTERIZATION; ELASTICITY; FILM THICKNESS; GRAIN BOUNDARIES; GRAIN SIZE AND SHAPE; NANOCRYSTALLINE MATERIALS; PLASTIC FLOW; STRAIN RATE;

ELASTIC PROPERTY; HALL-PETCH BOUNDARY HARDENING; NANOCRYSTALLINE GOLD FILMS; PLASTIC PROPERTY;

GOLD;

EID: 38649134467     PISSN: 08842914     EISSN: None     Source Type: Journal    
DOI: 10.1557/jmr.2008.0032     Document Type: Article

References (66)

1. R.D. Emery and G.L. Povirk: Tensile behavior of free-standing gold films. Part I. Coarse-grained films. Acta Mater. 51, 2067 (2003).
2. R.D. Emery and G.L. Povirk: Tensile behavior of free-standing gold films. Part II. Fine-grained films. Acta Mater. 51, 2079 (2003).
3. I. Chasiotis, C. Bateson, K. Timpano, A.S. McCarty, N.S. Barker, and J.R. Stanec: Strain rate effects on the mechanical behavior of nanocrystalline Au films. Thin Solid Films 515, 3183 (2007).
4. D.T. Read, Y.W. Cheng, R.R. Keller, and J.D. McColskey: Tensile properties of free-standing aluminum thin films. Scripta Mater. 45, 583 (2001).
5. P.A. El-Deiry and R.P. Vinci: Strain rate dependent behavior of pure aluminum and copper micro-wires, in Thin Films: Stresses and Mechanical Properties IX, edited by C.S. Ozkan, L.B. Freund, R.C. Cammarata, and H. Gao (Mater. Res. Soc. Symp. Proc. 695, Warrendale, PA, 2002), L4.2.1, p. 159.
6. S. Sakai, H. Tanimoto, and H. Mizubayashi: Mechanical behavior of high-density nanocrystalline gold prepared by gas deposition method. Acta Mater. 47, 211 (1998).
7. J. Mahan and G.T. Charbeneau: A study of certain mechanical properties and the density of condensed specimens made from various forms of pure gold. J. Am. Acad. Gold Foil Oper. 8, 6 (1965).
8. T. Nenadovi, N. Bibi, N. Kraljevi, and M. Adamov: Mechanical properties of dental gold thin films. Thin Solid Films 34, 211 (1976).
9. B.C. Prorok and H.D. Espinosa: Effects of nanometer-thick passivation layers on the mechanical response of thin gold films. J. Nanosci. Nanotechnol. 2, 427 (2002).
10. H.D. Espinosa, B.C. Prorok, and M. Fischer: A methodology for determining mechanical properties of freestanding thin films and MEMS materials. J. Mech. Phys. Solids 51, 47 (2003).
11. H.D. Espinosa, B.C. Prorok, and B. Peng: Plasticity size effects in free-standing submicron polycrystalline FCC films subjected to pure tension. J. Mech. Phys. Solids 52, 667 (2004).
12. ASTM E 112-96e1, Standard Test Methods for Determining Average Grain Size, (ASTM International, West Conshohocken, PA, 1996). Available at www.astm.org.
13. C.V. Thompson: Structure evolution during processing of polycrystalline films. Ann. Rev. Mater. Sci. 30, 159 (2000).
14. C.L. Liu, J.M. Cohen, J.B. Adams, and A.F. Voter: EAM study of surface self-diffusion of single adatoms of fcc metals Ni, Cu, Al, Ag, Au, Pd, and Pt. Surf. Sci. 253, 334 (1991).
15. C.V. Thompson and R. Carel: Texture development in polycrystalline thin-films. Mater. Sci. Eng., B. 32, 211 (1995).
16. L. Vitos, A.V. Ruban, H.L. Skriver, and J. Kollár: The surface energy of metals. Surf. Sci. 411, 186 (1998).
17. H.J. Bunge: Texture Analysis in Materials Science (Butterworths, Toronto, 1982).
18. A.J. Schwartz, M. Kumar, and B.L. Adams: Electron Backscatter Diffraction in Materials Science (Kluwer Academic Publishers, New York, 2000).
19. U.F. Kocks, C.N. Tomé, H.R. Wenk, and H. Mecking: Texture and Anisotropy (Cambridge University Press, Cambridge, 2001).
20. N.J. Park, D.P. Field, M.M. Nowell, and P.R. Besser: Effect of film thickness on the evolution of annealing texture in sputtered copper films. J. Electron. Mater. 34, 1500 (2005).
21. P. Sonnweber-Ribic, P. Gruber, G. Dehm, and E. Arzt: Texture transition in Cu thin films: Electron backscatter diffraction vs. x-ray diffraction. Acta Mater. 54, 3863 (2006).
22. M.T. Perez-Prado and J.J. Vlassak: Microstructural evolution in electroplated Cu thin films. Scripta Mater. 47, 817 (2002).
23. J-M. Zhang, K-W. Xu, and V. Ji: Competition between surface and strain energy during grain growth in free-standing and attached Ag and Cu films on Si substrates. Appl. Surf. Sci. 187, 60 (2002).
24. C.V. Thompson and R. Carel: Grain growth and texture evolution in thin films. Mater. Sci. Forum 204-206, 83 (1996).
25. C.V. Thompson and R. Carel: Stress and grain growth in thin films. J. Mech. Phys. Solids. 44, 657 (1996).
26. W.D. Nix: Mechanical properties of thin films. Metall. Trans. A 20, 2217 (1989).
27. C.A. Neugebauer, J.B. Newkirk, and D.A. Vermilyea: Structure and Properties of Thin Films (John Wiley & Sons, New York, 1959).
28. T.P. Weihs, S. Hong, J.C. Bravman, and W.D. Nix: Mechanical deflection of cantilever microbeams - A new technique for testing the mechanical-properties of thin-films. J. Mater. Res. 3, 931 (1988).
29. T.P. Weihs, S. Hong, J.C. Bravman, and W.D. Nix: Measuring the strength and stiffness of thin film materials by mechanically deflecting cantilever microbeams, in Thin Films: Stresses and Mechanical Properties, edited by J.C. Bravman, W.D. Nix, D.M. Barnett, and D.A. Smith (Mater. Res. Soc. Symp. Proc. 130, Pittsburgh, PA, 1989), p. 87.
30. C.W. Baek, Y.K. Kim, Y. Ahn, and Y.H. Kim: Measurement of the mechanical properties of electroplated gold thin films using micromachined beam structures. Sens. Actuators, A Phys. 117, 17 (2005).
31. L. Wang and B.C. Prorok: Investigation of the influence of grain size, texture and orientation on the mechanical behavior of free-standing polycrystalline gold films, in Mechanics of Nanoscale Materials and Devices, edited by A. Misra, J.P. Sullivan, H. Huang, K. Lu, and S. Asif (Mater. Res. Soc. Symp. Proc. 924E, Warrendale, PA, 2006), 0924-Z03-13.
32. M.A. Haque and M.T.A. Saif: Deformation mechanisms in free-standing nanoscale thin films: A quantitative in situ transmission electron microscope study. Proc. Natl. Acad. Sci. U.S.A. 101, 6335 (2004).
33. H. Gleiter: Nanocrystalline materials. Prog. Mater. Sci. 33, 223 (1989).
34. H. VanSwygenhoven and A. Caro: Plastic behavior of nanophase Ni: A molecular dynamics computer simulation. Appl. Phys. Lett. 71, 1652 (1997).
35. J. Schiotz, F.D. Di Tolla, and K.W. Jacobsen: Softening of nanocrystalline metals at very small grain sizes. Nature 391, 561 (1998).
36. L. Lu, S.X. Li, and K. Lu: An abnormal strain rate effect on tensile behavior in nanocrystalline copper. Scripta Mater. 45, 1163 (2001).
37. E.O. Hall: The deformation and ageing of mild steel.3. Discussion of results. Proc. Phys. Soc. London B, 64, 747 (1951).
38. N.J. Petch: The cleavage strength of polycrystals. J. Iron Steel Inst. 174, 25 (1953).
39. M.F. Ashby: Deformation of plastically non-homogeneous materials. Philos. Mag. 21, 399 (1970).
40. H. Conrad and K. Jung: Effect of grain size from mm to nm on the flow stress and plastic deformation kinetics of Au at low homologous temperatures. Mater. Sci. Eng., A 406, 78 (2005).
41. H. Van Swygenhoven and J.R. Weertman: Deformation in nanocrystalline metals. Mater. Today 9, 24 (2006).
42. F. Wang and K. Xu: An investigation of nanoindentation creep in polycrystalline Cu thin film. Mater. Lett. 58, 2345 (2004).
43. K. Gall, N. West, K. Spark, M.L. Dunn, and D.S. Finch: Creep of thin film Au on bimaterial Au/Si microcantilevers. Acta Mater. 52, 2133 (2004).
44. F.R.N. Nabarro: Creep at very low rates. Metall. Mater. Trans. A: Phys. Metall. Mater. Sci. 33, 213 (2002).
45. J. Weertman: Creep of polycrystalline aluminium as determined from strain rate tests. J. Mech. Phys. Solids 4, 230 (1956).
46. A.M. Brown and M.F. Ashby: On the power-law creep equation. Scripta Metall. 14, 1297 (1980).
47. R.L. Coble: A model for boundary diffusion controlled creep in polycrystalline materials. J. Appl. Phys. 34, 1679 (1963).
48. A.K. Mukherjee, J.E. Bird, and J.E. Dorn: Experimental correlations for high-temperature creep. Trans. ASM 62, 155 (1969).
49. R.L. Stocker and M.F. Ashby: On the empirical constants in the Dorn equation (dislocation creep). Scripta Metall. 7, 115 (1973).
50. J.P. Hirth and J. Lothe: Theory of Dislocations (McGraw Hill, New York, 1968).
51. S.L. Robinson and O.D. Sherby: Mechanical behavior of polycrystalline tungsten at elevated temperature. Acta Metall. 17, 109 (1969).
52. S. Sakai, H. Tanimoto, E. Kita, and H. Mizubayashi: Characteristic creep behavior of nanocrystalline metals found for high-density gold. Phys. Rev. B 66, 214106 (2002).
53. M.F. Ashby and R.A. Verrall: Diffusion-accommodated flow and superplasticity. Acta Metall. 21, 149 (1973).
54. G. Palumbo, S.J. Thorpe, and K.T. Aust: On the contribution of triple junctions to the structure and properties of nanocrystalline materials. Scripta Metall. Mater. 24, 1347 (1990).
55. N. Wang, Z. Wang, K.T. Aust, and U. Erb: Effect of grain size on mechanical properties of nanocrystalline materials. Acta Metall. 43, 519 (1995).
56. K.E. Harris and A.H. King: Direct observation of diffusional creep via TEM in polycrystalline thin films of gold. Acta Mater. 46, 6195 (1998).
57. N. Yagi, A. Rikukawa, H. Mizubayashi, and H. Tanimoto: Deformation by grain rotations in nanocrystalline fcc-metals. Mater. Sci. Eng., A 442, 323 (2006).
58. N. Yagi, A. Rikukawa, H. Mizubayashi, and H. Tanimoto: Experimental tests of the elementary mechanism responsible for creep deformation in nanocrystalline gold. Phys. Rev. B 74, 144105 (2006).
59. B. Cai, Q.P. Kong, L. Lu, and K. Lu: Interface controlled diffusional creep of nanocrystalline pure copper. Scripta Mater. 41, 755 (1999).
60. D.L. Wang, Q.P. Kong, and J.P. Shui: Creep of nanocrystalline Ni-P alloy. Scripta Metall. Mater. 31, 47 (1994).
61. J. Deng, D.L. Wang, Q.P. Kong, and J.P. Shui: Stress dependence of creep in nanocrystalline Ni-P alloy. Scripta Metall. Mater. 32, 349 (1995).
62. P.G. Sanders, M. Rittner, E. Kiedaisch, J.R. Weertman, H. Kung, and Y.C. Lu: Creep of nanocrystalline Cu, Pd, and Al-Zr. Nanostruct. Mater. 9, 433 (1997).
63. Y.M. Wang, A.V. Hamza, and E. Ma: Temperature-dependent strain rate sensitivity and activation volume of nanocrystalline Ni. Acta Mater. 54, 2715 (2006).
64. W.F. Gale and T.C. Totemeier: Smithells Metals Reference Book, 8th ed. (Elsevier, 2004).
65. H.J. Frost and M.F. Ashby: Deformation Mechanism Maps (Pergamon Press, New York, 1982).
66. J. Horvath, R. Birringer, and H. Gleiter: Diffusion in nanocrystalline material. Solid State Commun. 62, 319 (1987).