Room temperature creep behavior of nanocrystalline nickel produced by an electrodeposition technique

Materials Science and Engineering: A

Volumn 237, Issue 2, 1997, Pages 150-158

  Wang, Ning ^a   Wang, Zhirui ^a   Aust, K T ^a   Erb, U ^b  

^a UNIVERSITY OF TORONTO   (Canada)

^b QUEEN S UNIVERSITY   (Canada)

Author keywords

Creep; Hall Petch relationship; Nanocrystalline materials; Nickel

Indexed keywords

CREEP; DIFFUSION; NICKEL;

CREEP TESTING; DIFFUSION IN SOLIDS; ELECTRODEPOSITION; GRAIN BOUNDARIES; MASS TRANSFER; MATHEMATICAL MODELS; NANOSTRUCTURED MATERIALS; STRAIN; STRESS ANALYSIS; TENSILE TESTING;

HALL PETCH RELATIONSHIP;

NICKEL;

EID: 0041822942     PISSN: 09215093     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0921-5093(97)00124-X     Document Type: Article

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