Thermally activated dislocation depinning at a grain boundary in nanocrystalline and ultrafine-grained materials

Materials Science and Engineering: A

Volumn 516, Issue 1-2, 2009, Pages 276-282

  Kato, Masaharu ^a  

^a TOKYO INSTITUTE OF TECHNOLOGY   (Japan)

Author keywords

Dislocations; Nanocrystalline materials; Thermally activated process; Ultrafine grained materials; Yield strength

Indexed keywords

ACTIVATION ENERGY; GRAIN BOUNDARIES; NANOCRYSTALLINE MATERIALS; NANOCRYSTALS; STRAIN RATE; STRENGTH OF MATERIALS;

DEPINNING; DISLOCATION; DISLOCATION DEPINNING; ENERGY ACTIVATION; GRAIN-BOUNDARIES; NANOCRYSTALLINES; STRAIN RATE DEPENDENCE; THERMALLY ACTIVATED; THERMALLY ACTIVATED PROCESS; ULTRAFINE GRAINED MATERIALS;

YIELD STRESS;

EID: 67649785254     PISSN: 09215093     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.msea.2009.03.035     Document Type: Article

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