Techniques for measuring thermal expansion and creep of polysilicon

Sensors and Actuators, A: Physical

Volumn 112, Issue 1, 2004, Pages 66-73

  Oh, C S ^a   Sharpe Jr , W N ^b  

^a Kumoh National Institute of Technology   (South Korea)

^b Johns Hopkins University   (United States)

Author keywords

Creep; Interferometry; Polysilicon; Temperature; Thermal expansion

Indexed keywords

CREEP; HIGH TEMPERATURE EFFECTS; INTERFEROMETRY; MICROELECTROMECHANICAL DEVICES; POLYSILICON; STRAIN MEASUREMENT; THERMAL EXPANSION;

CREEP BEHAVIOR; LASER INTERFEROMETRY; SILICON BEAMS; SILICON FILMS;

THIN FILMS;

EID: 2142812937     PISSN: 09244247     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.sna.2003.12.010     Document Type: Article

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