High strength-ductility of thin nanocrystalline palladium films with nanoscale twins: On-chip testing and grain aggregate model

Acta Materialia

Volumn 60, Issue 4, 2012, Pages 1795-1806

  Colla, M S ^a   Wang, B ^b   Idrissi, H ^b   Schryvers, D ^b   Raskin, J P ^a   Pardoen, T ^a  

^a UNIVERSITÉ CATHOLIQUE DE LOUVAIN   (Belgium)

^b UNIVERSITY OF ANTWERP   (Belgium)

Author keywords

Analytical modelling; Nanocrystalline film; Strengthening mechanism; Tensile testing; Twinning

Indexed keywords

AGGREGATE MODEL; ANALYTICAL MODELLING; FLOW BEHAVIOURS; GRAIN SIZE; IN-PLANE GRAIN SIZE; LARGE STRAINS; MECHANICAL BEHAVIOUR; NANO-SCALE TWINS; NANOCRYSTALLINE FILMS; NANOCRYSTALLINE PALLADIUM; NANOTWINS; ON CHIPS; SEMI-ANALYTICAL; STRENGTHENING MECHANISM; THIN SURFACE LAYER; UNIAXIAL TENSIONS;

AGGLOMERATION; GRAIN SIZE AND SHAPE; STRAIN HARDENING; TENSILE TESTING; TRANSMISSION ELECTRON MICROSCOPY; TWINNING;

AGGREGATES;

EID: 84863115300     PISSN: 13596454     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.actamat.2011.11.054     Document Type: Article

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