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Volumn 37, Issue 8, 2008, Pages 1139-1147
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Three-dimensional finite element analysis of multiple-grained lead-free solder interconnects
a
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Author keywords
Digital image correlation; Finite element modeling; Grain boundary; Pb free
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Indexed keywords
CROSS POLARIZERS;
CROSS SECTIONING;
DEFORMATION MAPS;
ELECTRONIC PACKAGING;
EXPERIMENTAL TECHNIQUES;
FINITE ELEMENT (FE) MODELING;
FULL-FIELD;
GRID ARRAY INTERCONNECTS;
IN-SITU;
LEAD-FREE SOLDER (SN-3.5AG-0.5CU);
NON UNIFORM;
NON UNIFORMITIES;
NUMERICA L RESULTS;
OPTICAL (PET) (OPET);
ORIENTATION IMAGING MICROSCOPY (OIM);
PLASTIC DAMAGE;
SOLDER BALLS;
SOLDER INTERFACES;
STRAIN DISTRIBUTIONS;
STRAIN LOCALIZATIONS;
THREE DIMENSIONAL (3D) NUMERICAL SIMULATIONS;
THREE-DIMENSIONAL (3D) SHAPES;
THREE-DIMENSIONAL FINITE ELEMENT ANALYSIS (FEA);
AGRICULTURAL PRODUCTS;
BRAZING;
COMPUTER SIMULATION;
COUPLED CIRCUITS;
CRYSTAL GROWTH;
FINITE DIFFERENCE METHOD;
FINITE ELEMENT METHOD;
GRAIN (AGRICULTURAL PRODUCT);
GRAIN BOUNDARIES;
GRAIN SIZE AND SHAPE;
IMAGING TECHNIQUES;
LEAD;
LITHOGRAPHY;
METAL ANALYSIS;
MICROSCOPES;
MICROSCOPIC EXAMINATION;
OPTICAL MICROSCOPY;
PACKAGING;
SOLDERING;
THREE DIMENSIONAL;
WELDING;
METALS;
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EID: 46749135131
PISSN: 03615235
EISSN: None
Source Type: Journal
DOI: 10.1007/s11664-008-0481-9 Document Type: Article |
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Times cited : (33)
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References (17)
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