Role of Cu in dissolution kinetics of Cu metallization in molten Sn-based solders

Applied Physics Letters

Volumn 86, Issue 18, 2005, Pages 1-3

  Huang, M L ^a,b   Loeher, T ^c   Ostmann, A ^b   Reichl, H ^b  

^a DALIAN UNIVERSITY OF TECHNOLOGY   (China)

^b FRAUNHOFER IZM   (Germany)

^c TECHNISCHE UNIVERSITÄT BERLIN   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

DISSOLUTION; METALLIZING; MOLTEN MATERIALS; REACTION KINETICS; SOLDERING ALLOYS; TIN;

DISSOLUTION KINETICS; DISSOLUTION RATE; MOLTEN SOLDERS; SOLUBILITY LIMIT;

COPPER;

EID: 20844459962     PISSN: 00036951     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.1925317     Document Type: Article

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