Growth behavior of Cu6Sn5 grains formed at an Sn3.5Ag/Cu interface

Materials Letters

Volumn 65, Issue 10, 2011, Pages 1506-1509

  Yang, Ming ^a   Li, Mingyu ^a   Wang, Ling ^b   Fu, Yonggao ^b   Kim, Jongmyung ^c   Weng, Lvqian ^a  

^a HARBIN INSTITUTE OF TECHNOLOGY   (China)

^b China National Electric Apparatus Research Institute   (China)

^c Jeonnam Provincial College   (South Korea)

Author keywords

Crystal orientation; Cu6Sn5; Lead free solder; Morphology evolution

Indexed keywords

CU6SN5; FACETED SURFACES; GROWTH BEHAVIOR; LEAD-FREE SOLDER; MOLTEN SOLDERS; MORPHOLOGY EVOLUTION; REACTION TEMPERATURE;

MORPHOLOGY; SOLDERING; TIN;

CRYSTAL ORIENTATION;

EID: 79953182293     PISSN: 0167577X     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.matlet.2011.02.056     Document Type: Article

References (9)

1. T. Laurila, V. Vuorinen, and J.K. Kivilahti Mater Sci Eng R 49 2005 1 23
2. A.M. Gusak, and K.N. Tu Phys Rev B 66 2002 115403
3. K.N. Tu Spinger Ser Mater Sci 92 2007 52 53
4. H.F. Zou, H.J. Yang, and Z.F. Zhang Acta Mater 56 2008 2649 2662
5. M. Yang, M.Y. Li, L. Wang, Y.G. Fu, and J. Kim J Electron Mater 40 2011 176 188
6. W.K. Choi, S.Y. Jang, J.H. Kim, K.W. Paik, and H.M. Lee J Mater Res 17 2002 597 599
7. K.H. Prakash, and T. Sritharan Acta Mater 49 2001 2481 2489
8. K.A. Jackson Prog Solid State Chem 4 1967 53 80
9. D. Ma, W.D. Wang, and S.K. Lahiri J Appl Phys 91 2002 3312 3317