SCOPUS 정보 검색 플랫폼

Journal of Electronic Materials

Volumn 40, Issue 2, 2011, Pages 176-188

Cu 6Sn 5 morphology transition and its effect on mechanical properties of eutectic Sn-Ag solder joints

(6) Yang, Ming a Li, Mingyu a Wang, Ling b Fu, Yonggao b Kim, Jongmyung c Weng, Lvqian a

a HARBIN INSTITUTE OF TECHNOLOGY (China)

b China National Electric Apparatus Research Institute (China)

c Jeonnam Provincial College (South Korea)

Author keywords

Cu 6Sn 5; lead free solder; morphology transition; shear strength

Indexed keywords

CU CONTENT; CU SUBSTRATE; CU 6SN 5; JACKSON; JOINT STRENGTH; LEAD-FREE SOLDER; MOLTEN SOLDERS; MORPHOLOGY TRANSITION; MORPHOLOGY TRANSITIONS; PEAK TEMPERATURES; SHEAR HEIGHT; SN-3.5AG; SN-AG SOLDER; SOLDER JOINTS; SOLDER MATRIX; WETTING REACTION;

DENDRITES (METALLOGRAPHY); MECHANICAL PROPERTIES; MORPHOLOGY; SHEAR STRENGTH; SOLDERING ALLOYS; WETTING;

TIN;

EID: 79951513780 PISSN: 03615235 EISSN: None Source Type: Journal
DOI: 10.1007/s11664-010-1430-y Document Type: Article

Times cited : (63)

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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.