Textured growth of Cu6Sn5 grains formed at a Sn3.5Ag/Cu interface

Materials Letters

Volumn 66, Issue 1, 2012, Pages 135-137

  Li, Mingyu ^a   Yang, Ming ^a   Kim, Jongmyung ^b  

^a HARBIN INSTITUTE OF TECHNOLOGY   (China)

^b Jeonnam Provincial College   (South Korea)

Author keywords

Crystal growth; Cu6Sn5; Lead free solder; Texture

Indexed keywords

GROWTH ORIENTATIONS; JOINT PROPERTY; LEAD FREE SOLDERS; POLYCRYSTALLINE; REACTION TEMPERATURE; SN-3.5AG; TEXTURE FORMATION; TEXTURED GROWTH;

CRYSTAL GROWTH; CRYSTAL ORIENTATION; DIFFRACTIVE OPTICS; SINGLE CRYSTALS; TEXTURES;

TIN;

EID: 80052839547     PISSN: 0167577X     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.matlet.2011.08.014     Document Type: Article

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