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Applied Physics Letters

Volumn 98, Issue 20, 2011, Pages

Polymorphic transformation mechanism of η and η′ in single crystalline Cu6Sn5

(3) Li, M Y a Zhang, Z H a Kim, J M b

a HARBIN INSTITUTE OF TECHNOLOGY (China)

b Jeonnam Provincial College (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

FIELD EMISSION SCANNING ELECTRON MICROSCOPES; NUCLEATION AND GROWTH; POLYMORPHIC TRANSFORMATION; ROOM TEMPERATURE; SINGLE-CRYSTALLINE; VOLUMETRIC STRAIN; X RAY DIFFRACTOMETERS;

CRYSTALLINE MATERIALS; DIFFERENTIAL SCANNING CALORIMETRY; FIELD EMISSION; SCANNING ELECTRON MICROSCOPY; TIN;

ORDER DISORDER TRANSITIONS;

EID: 79957547463 PISSN: 00036951 EISSN: None Source Type: Journal
DOI: 10.1063/1.3590715 Document Type: Article

Times cited : (42)

References (19)

1
- 0004090993
- (McGraw-Hill, New York)
- R. R. Tummala, Fundamentals of Microsystems Packaging (McGraw-Hill, New York, 2001).
- (2001) Fundamentals of Microsystems Packaging
- Tummala, R.R.¹

2
- 33847692949
- 0028-0836, 10.1038/122054a0
- J. D. Bernal, Nature (London) 0028-0836 122, 54 (1928). 10.1038/122054a0
- (1928) Nature (London) , vol.122 , pp. 54
- Bernal, J.D.¹

3
- 0015665604
- 0026-086X, 10.1007/BF02643268
- A. Gangulee, G. C. Das, and M. B. Bever, Metall. Trans. 0026-086X 4, 2063 (1973). 10.1007/BF02643268
- (1973) Metall. Trans. , vol.4 , pp. 2063
- Gangulee, A.¹ Das, G.C.² Bever, M.B.³

4
- 0000985936
- 0044-2968, 10.1524/zkri.1995.210.11.832
- A. K. Larsson, L. Stenberg, and S. Lidin, Z. Kristallogr. 0044-2968 210, 832 (1995). 10.1524/zkri.1995.210.11.832
- (1995) Z. Kristallogr. , vol.210 , pp. 832
- Larsson, A.K.¹ Stenberg, L.² Lidin, S.³

5
- 0001646726
- 0108-7681, 10.1107/S0108768194004052
- A. K. Larsson, L. Stenberg, and S. Lidin, Acta Crystallogr., Sect. B: Struct. Sci. 0108-7681 50, 636 (1994). 10.1107/S0108768194004052
- (1994) Acta Crystallogr., Sect. B: Struct. Sci. , vol.50 , pp. 636
- Larsson, A.K.¹ Stenberg, L.² Lidin, S.³

6
- 34547677920
- 5 formed on (001) single crystal copper in reaction between molten SnPb solder and Cu
- DOI 10.1063/1.2761840
- J. O. Suh, K. N. Tu, and N. Tamura, Appl. Phys. Lett. 0003-6951 91, 051907 (2007). 10.1063/1.2761840 (Pubitemid 47210785)
- (2007) Applied Physics Letters , vol.91 , Issue.5 , pp. 051907
- Suh, J.O.¹ Tu, K.N.² Tamura, N.³

7
- 44449117311
- 1359-6454, 10.1016/j.actamat.2008.01.055
- H. F. Zhou, H. J. Yang, and Z. F. Zhang, Acta Mater. 1359-6454 56, 2649 (2008). 10.1016/j.actamat.2008.01.055
- (2008) Acta Mater. , vol.56 , pp. 2649
- Zhou, H.F.¹ Yang, H.J.² Zhang, Z.F.³

8
- 46649120695
- (Springer, New York)
- K. N. Tu, Solder Joint Technology Materials, Properties and Reliability (Springer, New York, 2007).
- (2007) Solder Joint Technology Materials, Properties and Reliability
- Tu, K.N.¹

9
- 72449181692
- 0021-8979, 10.1063/1.3266144
- H. F. Zou, H. J. Yang, and Z. F. Zhang, J. Appl. Phys. 0021-8979 106, 113512 (2009). 10.1063/1.3266144
- (2009) J. Appl. Phys. , vol.106 , pp. 113512
- Zou, H.F.¹ Yang, H.J.² Zhang, Z.F.³

10
- 73449103583
- 0040-6090, 10.1016/j.tsf.2009.11.080
- K. K. Wang, D. Gan, and K. C. Hsieh, Thin Solid Films 0040-6090 518, 1667 (2010). 10.1016/j.tsf.2009.11.080
- (2010) Thin Solid Films , vol.518 , pp. 1667
- Wang, K.K.¹ Gan, D.² Hsieh, K.C.³

11
- 78349307828
- 0040-6090, 10.1016/j.tsf.2010.09.045
- K. K. Wang, D. Gan, and K. C. Hsieh, Thin Solid Films 0040-6090 519, 1380 (2010). 10.1016/j.tsf.2010.09.045
- (2010) Thin Solid Films , vol.519 , pp. 1380
- Wang, K.K.¹ Gan, D.² Hsieh, K.C.³

12
- 31144440721
- 5
- DOI 10.1063/1.2165280, 031913
- N. T. S. Lee, V. B. C. Tan, and K. M. Lim, Appl. Phys. Lett. 0003-6951 88, 031913 (2006). 10.1063/1.2165280 (Pubitemid 43133680)
- (2006) Applied Physics Letters , vol.88 , Issue.3 , pp. 1-3
- Lee, N.T.S.¹ Tan, V.B.C.² Lim, K.M.³

13
- 20344388336
- Interfacial reactions between lead-free solders and common base materials
- DOI 10.1016/j.mser.2005.03.001, PII S0927796X05000513
- T. Laurila, V. Vuorinen, and J. K. Kivilahti, Mater. Sci. Eng. R 49, 1 (2005). 10.1016/j.mser.2005.03.001 0927-796X (Pubitemid 40788671)
- (2005) Materials Science and Engineering R: Reports , vol.49 , Issue.1-2 , pp. 1-60
- Laurila, T.¹ Vuorinen, V.² Kivilahti, J.K.³

14
- 76749127210
- 0003-6951, 10.1063/1.3310019
- U. Schwingenschlögl, C. Di Paola, K. Nogita, and C. M. Gourlay, Appl. Phys. Lett. 0003-6951 96, 061908 (2010). 10.1063/1.3310019
- (2010) Appl. Phys. Lett. , vol.96 , pp. 061908
- Schwingenschlögl, U.¹ Di Paola, C.² Nogita, K.³ Gourlay, C.M.⁴

15
- 70349745521
- 1047-4838, 10.1007/s11837-009-0087-6
- K. Nogita, C. M. Gourlay, and T. Nishimura, JOM 1047-4838 61, 45 (2009). 10.1007/s11837-009-0087-6
- (2009) JOM , vol.61 , pp. 45
- Nogita, K.¹ Gourlay, C.M.² Nishimura, T.³

16
- 33645459546
- 0884-2914, 10.1557/JMR.2005.0371
- G. Ghosh and M. Asta, J. Mater. Res. 0884-2914 20, 3102 (2005). 10.1557/JMR.2005.0371
- (2005) J. Mater. Res. , vol.20 , pp. 3102
- Ghosh, G.¹ Asta, M.²

17
- 34848872225
- 5 scallop-type grains and Cu substrate in reactions between molten Sn-based solders and Cu
- DOI 10.1063/1.2776002
- J. O. Suh, K. N. Tu, and N. Tamura, J. Appl. Phys. 0021-8979 102, 063511 (2007). 10.1063/1.2776002 (Pubitemid 47508924)
- (2007) Journal of Applied Physics , vol.102 , Issue.6 , pp. 063511
- Suh, J.O.¹ Tu, K.N.² Tamura, N.³

18
- 3342990112
- 1073-5623
- X. J. Liu, C. P. Wang, I. Ohnuma, R. Kainuma, and K. Ishida, Metall. Mater. Trans. A 1073-5623 35A, 1641 (2004).
- (2004) Metall. Mater. Trans. A , vol.35 , pp. 1641
- Liu, X.J.¹ Wang, C.P.² Ohnuma, I.³ Kainuma, R.⁴ Ishida, K.⁵

19
- 0027642972
- 0022-3727, 10.1088/0022-3727/26/8B/011
- K. Sato, J. Phys. D: Appl. Phys. 0022-3727 26, B77 (1993). 10.1088/0022-3727/26/8B/011
- (1993) J. Phys. D: Appl. Phys. , vol.26 , pp. 77
- Sato, K.¹

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