Low-temperature sintering of nanoscale silver paste for large-area joints in power electronics modules

Key Engineering Materials

Volumn 353-358, Issue PART 4, 2007, Pages 2948-2953

  Lei, Thomas G ^a   Calata, Jesus ^a   Luo, Shufang ^a   Lu, Guo Quan ^a   Chen, Xu ^b  

^a Virginia Polytechnic Institute and State University   (United States)

^b TIANJIN UNIVERSITY   (China)

Author keywords

Large area joints; Lead free solution; Low temperature sintering; Nanoscale silver paste; Power electronics modules

Indexed keywords

COPPER; ELECTRONICS ENGINEERING; JOINTS (STRUCTURAL COMPONENTS); SEMICONDUCTOR DEVICES; SINTERING; THERMAL CONDUCTIVITY;

BONDING STRENGTH; ELECTRONICS MODULES; NANOSCALE SILVER PASTE; SOFT SOLDER ALLOYS;

SOLDERING ALLOYS;

EID: 36148997323     PISSN: 10139826     EISSN: 16629795     Source Type: Book Series    
DOI: 10.4028/0-87849-456-1.2948     Document Type: Conference Paper

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