Thermal residual stress analysis of epoxy bi-material laminates and bonded joints

International Journal of Adhesion and Adhesives

Volumn 30, Issue 7, 2010, Pages 523-538

  Jumbo, F S ^a   Ashcroft, I A ^a   Crocombe, A D ^b   Abdel Wahab, M M ^b  

^a LOUGHBOROUGH UNIVERSITY   (United Kingdom)

^b UNIVERSITY OF SURREY   (United Kingdom)

Author keywords

Aluminium alloy; Epoxy epoxides; Stress analysis; Thermal residual stress

Indexed keywords

3D STRESS; ADHERENDS; ALUMINIUM ALLOYS; ANALYSIS METHOD; ANALYTICAL SOLUTIONS; BI-MATERIAL; BI-MATERIAL STRIPS; BONDED JOINT; DOUBLE LAP JOINT; DRY ATMOSPHERES; EFFICIENT METHOD; EPOXY/EPOXIDES; FINITE ELEMENT ANALYSIS; FINITE-ELEMENT PREDICTIONS; MATERIAL NON-LINEARITY; PREDICTIVE METHODS; SINGLE LAP JOINTS; THERMAL RESIDUAL STRESS; THERMAL STRAIN;

ADHESIVE JOINTS; ALUMINUM; ALUMINUM ALLOYS; CONTINUUM MECHANICS; COOLING SYSTEMS; CREEP; ELASTICITY; MATHEMATICAL MODELS; RESIDUAL STRESSES; STRESS ANALYSIS; STRESS CONCENTRATION; STRIP METAL; THREE DIMENSIONAL;

FINITE ELEMENT METHOD;

EID: 77955518103     PISSN: 01437496     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.ijadhadh.2010.03.009     Document Type: Article

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