Review of metal matrix composites with high thermal conductivity for thermal management applications

Progress in Natural Science: Materials International

Volumn 21, Issue 3, 2011, Pages 189-197

  Qu, Xuan Hui ^a   Zhang, Lin ^a   Wu, Mao ^a   Ren, Shu Bin ^a  

^a UNIVERSITY OF SCIENCE AND TECHNOLOGY BEIJING   (China)

Author keywords

Brazing; Coefficient of thermal expansion; Electronic packaging; Metal matrix composites; Thermal conductivity

Indexed keywords

BRAZING; COPPER ALLOYS; ELECTRONICS PACKAGING; INJECTION MOLDING; METALLIC MATRIX COMPOSITES; POWDER METALLURGY; SILICON CARBIDE; SILVER ALLOYS; TEMPERATURE CONTROL; THERMAL CONDUCTIVITY; TIN ALLOYS;

BRAZING TECHNOLOGY; COEFFICIENT-OF-THERMAL EXPANSION; ELECTRONIC PACKAGE; ELECTRONIC PACKAGING; HIGH THERMAL CONDUCTIVITY; MANUFACTURING PROCESS; MATRIX COMPOSITE; METAL MATRIX; METAL MATRIX COMPOSITE; THERMAL MANAGEMENT APPLICATIONS;

THERMAL EXPANSION;

EID: 84861877690     PISSN: 10020071     EISSN: None     Source Type: Journal    
DOI: 10.1016/S1002-0071(12)60029-X     Document Type: Article

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