Properties of Ag-Au-Ge medium temperature solder

Beijing Keji Daxue Xuebao/Journal of University of Science and Technology Beijing

Volumn 30, Issue 12, 2008, Pages 1402-1405

  Li, Chunyuan ^a   Wang, Xitao ^a   Yuan, Wenxia ^a  

^a UNIVERSITY OF SCIENCE AND TECHNOLOGY BEIJING   (China)

Author keywords

Medium temperature; Melting property; Solder; Wettability

Indexed keywords

BRAZING; GALLIUM ALLOYS; GERMANIUM; MELTING; MELTING POINT; METALLIC COMPOUNDS; PHASE DIAGRAMS; PHASE INTERFACES; SILVER; SILVER ALLOYS; SUBSTRATES; WELDING;

EUTECTIC ALLOYS; INTERMETALLIC PHASE; LIQUIDUS; MEDIUM TEMPERATURE; MELTING PROPERTY; SOLDER ALLOYS; VACUUM MELTING; WETTABILITY;

ALLOYS;

EID: 58149312594     PISSN: 1001053X     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (9)

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