Thermal properties of diamond/copper composite material

Microelectronics Reliability

Volumn 44, Issue 2, 2004, Pages 303-308

  Yoshida, Katsuhito ^a,b   Morigami, Hideaki ^a  

^a Sumitomo Electric Hardmetal Corp   (Japan)

^b SUMITOMO ELECTRIC INDUSTRIES LTD   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

CALORIMETRY; COPPER; DIAMONDS; ELECTRONIC EQUIPMENT; HIGH PRESSURE EFFECTS; HIGH TEMPERATURE EFFECTS; INTEGRATED CIRCUITS; PACKAGING; PARTICLE SIZE ANALYSIS; PRODUCT DESIGN; SEMICONDUCTOR LASERS; SUBSTRATES; THERMAL CONDUCTIVITY; THERMAL EXPANSION; VOLUME FRACTION; X RAY DIFFRACTION ANALYSIS;

COEFFICIENT OF THERMAL EXPANSION (CTE); HEAT SPREADER MATERIALS; PACKAGE DESIGN;

COMPOSITE MATERIALS;

EID: 0942266450     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0026-2714(03)00215-4     Document Type: Article

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