Thermal properties of diamond-particle-dispersed Cu-matrix-composites fabricated by spark plasma sintering (SPS)

Materials Science Forum

Volumn 638-642, Issue , 2010, Pages 2115-2120

  Mizuuchi, Kiyoshi ^a   Inoue, Kanryu ^b   Agari, Yasuyuki ^a   Yamada, Shinji ^a   Tanaka, Motohiro ^a   Sugioka, Masami ^a   Takeuchi, Takashi ^a   Tani, Jun Ichi ^a   Kawahara, Masakazu ^c   Lee, Jun Hee ^d   Makino, Yukio ^e  

^a OSAKA MUNICIPAL TECHNICAL RESEARCH INSTITUTE   (Japan)

^b UNIVERSITY OF WASHINGTON   (United States)

^c SPS SYNTEX INC   (Japan)

^d Dong A University   (South Korea)

^e OSAKA UNIVERSITY   (Japan)

Author keywords

Composite; Copper; Diamond; Pulsed current; Spark plasma sintering; Thermal conductivity

Indexed keywords

COMPOSITE MATERIALS; COPPER; COPPER COMPOUNDS; FABRICATION; MAXWELL EQUATIONS; SCANNING ELECTRON MICROSCOPY; SPARK PLASMA SINTERING; THERMAL CONDUCTIVITY; THERMAL EXPANSION;

COATED DIAMOND PARTICLES; CU MATRIX COMPOSITES; DIAMOND PARTICLES; MATRIX COMPOSITE; PULSED CURRENTS; SINTERING TEMPERATURES; TEMPERATURE RANGE; THEORETICAL VALUES;

DIAMONDS;

EID: 75849153279     PISSN: 02555476     EISSN: 16629752     Source Type: Book Series    
DOI: 10.4028/www.scientific.net/MSF.638-642.2115     Document Type: Conference Paper

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