Effect of various Ni plating layers and aging on microstructure and shear strength of Sn-2.5Ag-2.0Ni solder joint

Surface and Coatings Technology

Volumn 203, Issue 20-21, 2009, Pages 3011-3018

  Wu, Mao ^a   He, Xinbo ^a   Rafi ud din, ^a   Ren, Shubin ^a   Qin, Mingli ^a   Qu, Xuanhui ^a  

^a UNIVERSITY OF SCIENCE AND TECHNOLOGY BEIJING   (China)

Author keywords

Aging; Electroless Ni plating; Intermetallic compound (IMC); SiCp Al composite; Soldering

Indexed keywords

AGING; ELECTROLESS NI; ELECTROLESS NI PLATING; EXPERIMENTAL STUDIES; INTERMETALLIC COMPOUND (IMC); KIRKENDALL VOID; LONG-TERM AGING; NI ALLOYS; NI COATING; NI PLATING; P-LAYER; REINFORCED ALUMINUM; SICP/AL COMPOSITE; SOLDER JOINTS;

ALUMINA; ALUMINUM; BRAZING; MICROSTRUCTURE; SEMICONDUCTING INTERMETALLICS; SHEAR STRENGTH; SILICON CARBIDE; SILVER; SILVER ALLOYS; SOLDERING ALLOYS; TIN; WELDING;

NICKEL;

EID: 67349263837     PISSN: 02578972     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.surfcoat.2009.03.014     Document Type: Article

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