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Volumn 40, Issue 13, 2005, Pages 3383-3393
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Identification and characterization of diffusion barriers for Cu/SiC systems
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Author keywords
[No Author keywords available]
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Indexed keywords
DIFFUSION BARRIERS;
INDUCTION COUPLED PLASMA MASS SPECTROMETRY (ICPMS);
INTERFACE INTERACTIONS;
LASER FLASH THERMAL DIFFUSIVITY;
CHARACTERIZATION;
COPPER COMPOUNDS;
DIFFUSION;
DISSOLUTION;
ELECTRON DIFFRACTION;
GLOW DISCHARGES;
INDUCTIVELY COUPLED PLASMA;
INTERFACES (MATERIALS);
LASER BEAM EFFECTS;
MASS SPECTROMETRY;
REACTION KINETICS;
SILICON CARBIDE;
THERMAL BARRIER COATINGS;
THERMAL CONDUCTIVITY;
THERMAL EXPANSION;
TRANSMISSION ELECTRON MICROSCOPY;
METALLIC MATRIX COMPOSITES;
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EID: 23744437283
PISSN: 00222461
EISSN: 15734803
Source Type: Journal
DOI: 10.1007/s10853-005-2847-1 Document Type: Article |
Times cited : (27)
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References (15)
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