Brazing of SiCp/Al composites for microelectronic packaging

Fenmo Yejin Cailiao Kexue yu Gongcheng/Materials Science and Engineering of Powder Metallurgy

Volumn 15, Issue 3, 2010, Pages 218-224

  Chang, Ling Ling ^a   He, Xin Bo ^a   Wu, Mao ^a   Qu, Xuan Hui ^a  

^a UNIVERSITY OF SCIENCE AND TECHNOLOGY BEIJING   (China)

Author keywords

Brazing; Intermetallic compounds; Microelectronic packaging; SiCp Al composites

Indexed keywords

AL COMPOSITES; AL SUBSTRATE; BONDING STRENGTH; BRAZING ALLOYS; BRAZING JOINTS; CU COMPOUNDS; CU ELEMENT; INTERMETALLIC COMPOUNDS; MELTING TEMPERATURES; MICROELECTRONIC PACKAGING; SICP/AL COMPOSITES;

ALLOYS; BRAZING; CHIP SCALE PACKAGES; COPPER ALLOYS; MELTING POINT; MICROELECTRONICS; SEMICONDUCTING INTERMETALLICS; SILICON CARBIDE; SILVER; SILVER ALLOYS;

ALUMINUM;

EID: 77955028294     PISSN: 16730224     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

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