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Volumn 46, Issue 11, 2011, Pages 3862-3867
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Fabrication and thermal conductivity of near-net-shaped diamond/copper composites by pressureless infiltration
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Author keywords
[No Author keywords available]
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Indexed keywords
COMPLICATED SHAPE;
COPPER COMPOSITES;
ELECTRONIC PACKAGING;
HIGH VACUUM;
INFILTRATION TEMPERATURES;
INFILTRATION TIME;
INTERFACIAL THERMAL RESISTANCE;
INTERFACIAL THICKNESS;
PRESSURELESS INFILTRATION;
PROPERTIES OF COMPOSITES;
RELATIVE DENSITY;
THERMAL PROPERTIES;
WETTING PROPERTY;
CARBIDES;
COPPER;
DIAMONDS;
ELECTRONICS PACKAGING;
PROTECTIVE ATMOSPHERES;
SEEPAGE;
THERMAL CONDUCTIVITY;
SOIL MECHANICS;
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EID: 79953802418
PISSN: 00222461
EISSN: 15734803
Source Type: Journal
DOI: 10.1007/s10853-011-5307-0 Document Type: Article |
Times cited : (31)
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References (13)
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