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Volumn 46, Issue 11, 2011, Pages 3862-3867

Fabrication and thermal conductivity of near-net-shaped diamond/copper composites by pressureless infiltration

Author keywords

[No Author keywords available]

Indexed keywords

COMPLICATED SHAPE; COPPER COMPOSITES; ELECTRONIC PACKAGING; HIGH VACUUM; INFILTRATION TEMPERATURES; INFILTRATION TIME; INTERFACIAL THERMAL RESISTANCE; INTERFACIAL THICKNESS; PRESSURELESS INFILTRATION; PROPERTIES OF COMPOSITES; RELATIVE DENSITY; THERMAL PROPERTIES; WETTING PROPERTY;

EID: 79953802418     PISSN: 00222461     EISSN: 15734803     Source Type: Journal    
DOI: 10.1007/s10853-011-5307-0     Document Type: Article
Times cited : (31)

References (13)
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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.