Selective interfacial bonding in Al(Si)-diamond composites and its effect on thermal conductivity

Composites Science and Technology

Volumn 66, Issue 15, 2006, Pages 2677-2685

  Ruch, P W ^a,b   Beffort, O ^a   Kleiner, S ^a   Weber, L ^c   Uggowitzer, P J ^b  

^a SWISS FEDERAL LABORATORIES FOR MATERIALS SCIENCE AND TECHNOLOGY   (Switzerland)

^b ETH ZURICH   (Switzerland)

^c EPFL   (Switzerland)

Author keywords

A. Metal matrix composites (MMCs); A. Particle reinforced composites; B. Interface; E. Liquid metal infiltration (LMI)

Indexed keywords

ADHESION; ALUMINUM; BONDING; DIAMONDS; ETCHING; METALLOGRAPHIC MICROSTRUCTURE; REINFORCEMENT; SILICON; THERMAL CONDUCTIVITY;

GAS PRESSURE INFILTRATION; MECHANICALLY ASSISTED INFILTRATION;

METALLIC MATRIX COMPOSITES;

BONDING; FRACTURE; INTERFACIAL PROPERTY; MATRIX; METAL; MICROSTRUCTURAL PROPERTY; SILICON; THERMAL CONDUCTIVITY; TRANSMISSION ELECTRON MICROSCOPY;

EID: 33748713646     PISSN: 02663538     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.compscitech.2006.03.016     Document Type: Article

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