Effect of P and aging on microstructure and shear strength of Sn-2.5Ag-2.0Ni/Ni(P) solder joints

Materials Chemistry and Physics

Volumn 121, Issue 1-2, 2010, Pages 259-266

  Wu, Mao ^a   He, Xinbo ^a   Rafi ud din, ^a   Ren, Shubin ^a   Qin, Mingli ^a   Qu, Xuanhui ^a  

^a UNIVERSITY OF SCIENCE AND TECHNOLOGY BEIJING   (China)

Author keywords

Coatings; Composite materials; Electron microscopy; Intermetallic compounds

Indexed keywords

AL COMPOSITES; DETRIMENTAL EFFECTS; DIFFUSION RATE; ELECTROLESS NI; ELECTROPLATED NI; HIGH GROWTH RATE; INTERMETALLIC COMPOUNDS; MECHANICAL RELIABILITY; NANOCRYSTALLINES; NI ALLOYS; NI COATING; SOLDER JOINTS;

COMPOSITE COATINGS; COMPOSITE MICROMECHANICS; DIFFUSION COATINGS; MICROSTRUCTURE; NANOCRYSTALLINE ALLOYS; RELIABILITY; SCANNING ELECTRON MICROSCOPY; SEMICONDUCTING INTERMETALLICS; SHEAR STRENGTH; SILICON CARBIDE; SILVER; SILVER ALLOYS; SOLDERING; SOLDERING ALLOYS;

TIN;

EID: 77949485812     PISSN: 02540584     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.matchemphys.2010.01.030     Document Type: Article

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