Interfacial reactions between Sn-2.5Ag-2.0Ni solder and electroless Ni(P) deposited on SiCp/Al composites

Transactions of Nonferrous Metals Society of China (English Edition)

Volumn 20, Issue 6, 2010, Pages 958-965

  Wu, Mao ^a   Qu, Xuan Hui ^a   He, Xin Bo ^a   Rafi Ud Din, ^a   Ren, Shu Bin ^a   Qin, Ming Li ^a  

^a UNIVERSITY OF SCIENCE AND TECHNOLOGY BEIJING   (China)

Author keywords

Electroless Ni(P); Interfacial reaction; Intermetallic compound; SiCp Al composites; SnAgNi solder

Indexed keywords

AL COMPOSITES; DIFFUSION CHANNELS; ELECTROLESS NI; ELECTROLESS NI-P; HIGH GROWTH RATE; IMC LAYER; INTERFACIAL REACTIONS; INTERMETALLIC COMPOUNDS; KIRKENDALL VOID; LOW GROWTH RATE; MASS FRACTION; NEEDLE-LIKE; NI ALLOYS; SOLDER JOINTS; SOLDER RELIABILITY;

ALUMINUM; SEMICONDUCTING INTERMETALLICS; SHEAR STRENGTH; SILICON CARBIDE; SILVER; SILVER ALLOYS; SOLDERING; SOLDERING ALLOYS;

TIN;

EID: 77955329989     PISSN: 10036326     EISSN: None     Source Type: Journal    
DOI: 10.1016/S1003-6326(09)60242-9     Document Type: Article

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