SCOPUS 정보 검색 플랫폼

Science in China, Series E: Technological Sciences

Volumn 52, Issue 1, 2009, Pages 238-242

Net-shape forming of composite packages with high thermal conductivity

(4) He, Xinbo a Qu, Xuanhui a Ren, Shubin a Jia, Chengchang a

a UNIVERSITY OF SCIENCE AND TECHNOLOGY BEIJING (China)

Author keywords

Composites packages; High thermal conductivity; Net shape forming

Indexed keywords

AMPLIFIERS (ELECTRONIC); CARBON FIBER REINFORCED PLASTICS; ELECTRONIC EQUIPMENT; FRACTURE MECHANICS; METALLIC COMPOUNDS; MICROELECTRONICS; OSCILLATORS (ELECTRONIC); PACKAGING MATERIALS; POWDER METALLURGY; THERMAL CONDUCTIVITY; THERMAL INSULATING MATERIALS; THERMOANALYSIS; THERMODYNAMIC PROPERTIES; THERMOELECTRICITY;

COMPOSITES PACKAGES; ELECTRONIC DEVICES; ELECTRONIC PACKAGES; HIGH THERMAL CONDUCTIVITY; NET SHAPES; NET-SHAPE FORMING; POWDER INJECTION MOLDINGS; SEMI-CONDUCTORS;

THERMAL CONDUCTIVITY OF SOLIDS;

EID: 58349101522 PISSN: 10069321 EISSN: 1862281X Source Type: Journal
DOI: 10.1007/s11431-008-0346-8 Document Type: Article

Times cited : (15)

References (6)

1
- 38749123517
- Interfacial design of Cu-based composites prepared by powder metallurgy for heat sink applications
- 1
- T. Schubert B. Trindade T. Weißgärber 2008 Interfacial design of Cu-based composites prepared by powder metallurgy for heat sink applications Mater Sci Eng A 475 1 39 44
- (2008) Mater Sci Eng A , vol.475 , pp. 39-44
- Schubert, T.¹ Trindade, B.² Weißgärber, T.³

2
- 58349114404
- 3 John Wiley & Sons, Inc. New York
- Zweben C. Composite Materials and Mechanical Design. Mechanical Engineers' Handbook, Book 1: Materials and Mechanical Design. Third Edition, Myer Kutz, Ed, New York: John Wiley & Sons, Inc., 2005
- (2005) Composite Materials and Mechanical Design. Mechanical Engineers' Handbook, Book 1: Materials and Mechanical Design
- Zweben, C.¹ Kutz, M.²

3
- 4544290877
- Fabrication and characterization of diffusion barriers for CuSiC metal matrix composites: The thermal management materials for next generation power electronics
- Suppl2
- P. Paul C. Sung G. Sundberg 2004 Fabrication and characterization of diffusion barriers for CuSiC metal matrix composites: The thermal management materials for next generation power electronics Microsc Microanal 10 Suppl2 620 621
- (2004) Microsc Microanal , vol.10 , pp. 620-621
- Paul, P.¹ Sung, C.² Sundberg, G.³

4
- 0003970588
- Pergamon Press Oxford
- Kelly A, Zweben C. Comprehensive Composite Materials. Oxford: Pergamon Press, 2000
- (2000) Comprehensive Composite Materials
- Kelly, A.¹ Zweben, C.²

5
- 34247562763
- Effect of Mg and Si in the aluminum on the thermo-mechanical properties of pressureless infiltrated SiCp/Al composites
- 10
- S. B. Ren X. B. He X. H. Qu 2007 Effect of Mg and Si in the aluminum on the thermo-mechanical properties of pressureless infiltrated SiCp/Al composites Composites Sci Tech 67 10 2103 2113
- (2007) Composites Sci Tech , vol.67 , pp. 2103-2113
- Ren, S.B.¹ He, X.B.² Qu, X.H.³

6
- 33845267432
- Effect of calcination process on the properties and microstructure of SiC preform and corresponding SiCp/Al composites synthesis by pressureless infiltration
- 1-2
- S. B. Ren X. B. He X. H. Qu 2007 Effect of calcination process on the properties and microstructure of SiC preform and corresponding SiCp/Al composites synthesis by pressureless infiltration Mater Sci Eng A 444 1-2 104 112
- (2007) Mater Sci Eng A , vol.444 , pp. 104-112
- Ren, S.B.¹ He, X.B.² Qu, X.H.³

* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.