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Volumn 50, Issue 11, 2009, Pages 2649-2655
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Hybrid interconnection process using solderable ICAs (Isotropic Conductive Adhesives) with low-melting-point alloy fillers
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Author keywords
Coalescence; Fluxing capability; Isotropic Conductive Adhesive; Low melting point alloy; Quad flat package (QFP); Tin bismuth; Wettability
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Indexed keywords
BONDABILITY;
BONDING PROCESS;
CONDUCTION PATHS;
ELECTRICAL CHARACTERISTIC;
ELECTRICAL CONDUCTION;
ELECTRICALLY CONDUCTIVE ADHESIVES;
ELECTRODE MATERIAL;
ELECTRONICS FIELDS;
FILLER PARTICLES;
INTERCONNECTION METHOD;
ISOTROPIC CONDUCTIVE ADHESIVES;
LOW MELTING POINT ALLOY;
MOLTEN SOLDERS;
OXIDE LAYER;
QUAD FLAT PACKAGE;
QUAD FLAT PACKAGE (QFP);
REDUCTANTS;
THERMAL CHARACTERISTICS;
WETTING BEHAVIOR;
WETTING CHARACTERISTICS;
X RAY INSPECTION SYSTEM;
ALLOYS;
BISMUTH;
CERIUM ALLOYS;
COALESCENCE;
DIFFERENTIAL SCANNING CALORIMETRY;
HEMODYNAMICS;
HYBRID MATERIALS;
INDEPENDENT COMPONENT ANALYSIS;
MELTING;
OPTICAL MICROSCOPY;
RESINS;
TIN;
TITANIUM COMPOUNDS;
WETTING;
FILLERS;
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EID: 73349098187
PISSN: 13459678
EISSN: None
Source Type: Journal
DOI: 10.2320/matertrans.M2009109 Document Type: Article |
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Times cited : (22)
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References (14)
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