Interfacial reaction of Cu/Sn-Ag/ENIG sandwich solder joint during aging

Advanced Materials Research

Volumn 15-17, Issue , 2007, Pages 1001-1007

  Yoon, Jeong Won ^a   Jung, Seung Boo ^a  

^a Sungkyunkwan University   (South Korea)

Author keywords

Aging; Electroless nickel immersion gold (ENIG); Interfacial reaction; Pb free solder; Sn Ag solder

Indexed keywords

BRAZING; COPPER; DISSOLUTION; INTERMETALLICS; LEAD; LEAD ALLOYS; METAL RECOVERY; NICKEL; NICKEL ALLOYS; SEMICONDUCTING INTERMETALLICS; SILVER; SOLDERING ALLOYS; WELDING;

AGING; ELECTROLESS NICKEL-IMMERSION GOLD (ENIG); INTERFACIAL REACTION; PB-FREE SOLDER; SN-AG SOLDER;

TIN;

EID: 35748958514     PISSN: 10226680     EISSN: None     Source Type: Book Series    
DOI: None     Document Type: Conference Paper

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