New process of self-organized interconnection in packaging using conductive adhesive with low melting point filler

Japanese Journal of Applied Physics, Part 1: Regular Papers and Short Notes and Review Papers

Volumn 43, Issue 4 B, 2004, Pages 2277-2282

  Yasuda, Kiyokazu ^a   Kim, Jong Min ^a   Yasuda, Masahiro ^a   Fujimoto, Kozo ^a  

^a OSAKA UNIVERSITY   (Japan)

Author keywords

Capillary wetting; Chip interconnection; Conductive adhesive; Electronics packaging; Low melting point alloy; Self organization

Indexed keywords

ADHESIVE PASTES; ADHESIVES; ANISOTROPY; CAPILLARY TUBES; CURING; ELECTRONICS PACKAGING; EPOXY RESINS; HEAT CONDUCTION; HYDRODYNAMICS; INTEGRATED CIRCUIT MANUFACTURE; MELTING; PROCESS CONTROL; SOLDERING ALLOYS;

CAPILLARY WETTING; CHIP INTERCONNECTIONS; CONDUCTIVE ADHESIVES; LOW MELTING POINT ALLOY; SELF-ORGANIZED INTERCONNECTIONS;

FILLERS;

EID: 3142643064     PISSN: 00214922     EISSN: None     Source Type: Journal    
DOI: 10.1143/JJAP.43.2277     Document Type: Conference Paper

References (9)

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