Self-organized interconnection process using solderable ACA (anisotropic conductive adhesive)

Materials Transactions

Volumn 50, Issue 7, 2009, Pages 1684-1689

  Yim, Byung Seung ^a   Kim, Jong Min ^a   Jeon, Sung Ho ^a   Lee, Seong Hyuk ^a   Kim, Jooheon ^b   Han, Jung Geun ^a   Eom, Yong Sung ^c   Shin, Young Eui ^a  

^a Chung Ang University   (South Korea)

^b School of Chemical Engineering and Material Science   (South Korea)

^c Electronics and Telecommunications Research Institute (ETRI)   (South Korea)

Author keywords

Coalescence; Electrically conductive adhesive; Fluxing capability; Low melting point alloy; Self organized interconnection; Tin bismuth wettability

Indexed keywords

ANISOTROPIC CONDUCTIVE ADHESIVES; ANISOTROPICALLY CONDUCTIVE ADHESIVE; ARRAY-TYPE; CONDUCTION PATHS; CU LINES; ELECTRICAL CONDUCTION; ELECTRICALLY CONDUCTIVE ADHESIVE; ELECTRODE MATERIAL; FLUXING CAPABILITY; LOW VISCOSITY; LOW-MELTING-POINT ALLOY; MICROFOCUSING; SELF-ORGANIZED INTERCONNECTION; TEMPERATURE PROFILES; THERMAL PROPERTIES; WETTING CHARACTERISTICS; X RAY INSPECTION SYSTEM;

ADHESIVE JOINTS; ADHESIVES; ALLOYS; BISMUTH; COALESCENCE; CONDUCTING POLYMERS; DIFFERENTIAL SCANNING CALORIMETRY; ELECTRONICS PACKAGING; FILLERS; MELTING; OXIDE FILMS; POLYMER FILMS; POLYMER MELTS; THERMODYNAMIC PROPERTIES; TIN; WETTING;

MELTING POINT;

EID: 69749095970     PISSN: 13459678     EISSN: None     Source Type: Journal    
DOI: 10.2320/matertrans.MF200918     Document Type: Conference Paper

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