SCOPUS 정보 검색 플랫폼

Journal of Electronic Materials

Volumn 38, Issue 12, 2009, Pages 2579-2584

TEM observations of the growth of intermetallic compounds at the SnBi/Cu interface

(4) Shang, P J a Liu, Z Q a Li, D X a Shang, J K a,b

a INSTITUTE OF METAL RESEARCH (China)

b United States of America (United States)

Author keywords

Diffusion; Growth mechanism; Interface; Intermetallic compound (IMC); SnBi solder

Indexed keywords

DIRECTIONAL GROWTH; GRAIN SIZE; GROWTH MECHANISMS; GROWTH OF INTERMETALLICS; IMC LAYER; INTERFACE; INTERFACE INTERMETALLIC COMPOUNDS; INTERMETALLIC COMPOUNDS; POLYCRYSTALLINE; SINGLE-CRYSTAL SUBSTRATES; SN GRAINS; SOLID-STATE AGING; TEM OBSERVATIONS;

GROWTH KINETICS; SEMICONDUCTING INTERMETALLICS; SOLDERING ALLOYS; TRANSMISSION ELECTRON MICROSCOPY;

TIN;

EID: 72549104063 PISSN: 03615235 EISSN: None Source Type: Journal
DOI: 10.1007/s11664-009-0894-0 Document Type: Article

Times cited : (40)

References (18)

1
- 20344388336
- Interfacial reactions between lead-free solders and common base materials
- DOI 10.1016/j.mser.2005.03.001, PII S0927796X05000513
- T Laurila V Vuorinen JK Kivilahti 2005 Mater. Sci. Eng. R 49 1 10.1016/j.mser.2005.03.001 (Pubitemid 40788671)
- (2005) Materials Science and Engineering R: Reports , vol.49 , Issue.1-2 , pp. 1-60
- Laurila, T.¹ Vuorinen, V.² Kivilahti, J.K.³

2
- 0035797072
- Tin-lead (SnPb) solder reaction in flip chip technology
- DOI 10.1016/S0927-796X(01)00029-8, PII S0927796X01000298
- KN Tu K Zeng 2001 Mater. Sci. Eng. R 34 1 10.1016/S0927-796X(01)00029-8 (Pubitemid 32536111)
- (2001) Materials Science and Engineering: R: Reports , vol.34 , Issue.1 , pp. 1-58
- Tu, K.N.¹ Zeng, K.²

3
- 21344461516
- Segregant-induced cavitation of Sn/Cu reactive interface
- DOI 10.1016/j.scriptamat.2005.05.033, PII S1359646205003404
- PL Liu JK Shang 2005 Scripta Mater. 53 631 10.1016/j.scriptamat.2005.05. 033 (Pubitemid 40908823)
- (2005) Scripta Materialia , vol.53 , Issue.6 , pp. 631-634
- Liu, P.L.¹ Shang, J.K.²

4
- 34848842467
- Interfacial reactions between eutectic SnZn solder and bulk or thin-film Cu substrates
- DOI 10.1007/s11664-007-0226-1
- CM Chen CH Chen 2007 J. Electron. Mater. 36 1363 10.1007/s11664-007-0226- 1 1:CAS:528:DC%2BD2sXht1WksrbN 2007JEMat..36.1363C (Pubitemid 47512659)
- (2007) Journal of Electronic Materials , vol.36 , Issue.10 , pp. 1363-1371
- Chen, C.-M.¹ Chen, C.-H.²

5
- 41849121849
- 10.1016/j.matchemphys.2008.01.021 1:CAS:528:DC%2BD1cXks1Git74%3D
- MS Suh CJ Park HS Kwon 2008 Mater. Chem. Phys. 110 95 10.1016/j.matchemphys.2008.01.021 1:CAS:528:DC%2BD1cXks1Git74%3D
- (2008) Mater. Chem. Phys. , vol.110 , pp. 95
- Suh, M.S.¹ Park, C.J.² Kwon, H.S.³

6
- 0015614563
- 10.1016/0001-6160(73)90190-9 1:CAS:528:DyaE3sXht12ht7Y%3D
- KN Tu 1973 Acta Metall. 21 347 10.1016/0001-6160(73)90190-9 1:CAS:528:DyaE3sXht12ht7Y%3D
- (1973) Acta Metall. , vol.21 , pp. 347
- Tu, K.N.¹

7
- 0032301787
- 10.1007/s11661-998-0202-2
- KJ Rönkä FJJ Van Loo JK Kivilahti 1998 Metall. Mater. Trans. A 29 2951 10.1007/s11661-998-0202-2
- (1998) Metall. Mater. Trans. A , vol.29 , pp. 2951
- Rönkä, K.J.¹ Van Loo, F.J.J.² Kivilahti, J.K.³

8
- 0037076832
- 10.1016/S0927-796X(02)00007-4
- K Zeng KN Tu 2002 Mater. Sci. Eng. R 38 55 10.1016/S0927-796X(02)00007-4
- (2002) Mater. Sci. Eng. R , vol.38 , pp. 55
- Zeng, K.¹ Tu, K.N.²

9
- 0037105149
- 10.1103/PhysRevB.66.115403 2002PhRvB.66k5403G
- AM Gusak KN Tu 2002 Phys. Rev. B 66 115403 10.1103/PhysRevB.66.115403 2002PhRvB..66k5403G
- (2002) Phys. Rev. B , vol.66 , pp. 115403
- Gusak, A.M.¹ Tu, K.N.²

10
- 44449117311
- 10.1016/j.actamat.2008.01.055 1:CAS:528:DC%2BD1cXmsFaisbk%3D
- HF Zou HJ Yang ZF Zhang 2008 Acta Mater. 56 2649 10.1016/j.actamat.2008. 01.055 1:CAS:528:DC%2BD1cXmsFaisbk%3D
- (2008) Acta Mater. , vol.56 , pp. 2649
- Zou, H.F.¹ Yang, H.J.² Zhang, Z.F.³

11
- 33646825381
- Interfacial reactions between molten Sn-Bi-X solders and Cu substrates for liquid solder interconnects
- DOI 10.1016/j.actamat.2006.02.030, PII S1359645406001650
- JF Li SH Mannan MP Clode DC Whalley DA Hutt 2006 Acta Mater. 54 2907 10.1016/j.actamat.2006.02.030 1:CAS:528:DC%2BD28XltVygsro%3D (Pubitemid 43776752)
- (2006) Acta Materialia , vol.54 , Issue.11 , pp. 2907-2922
- Li, J.F.¹ Mannan, S.H.² Clode, M.P.³ Whalley, D.C.⁴ Hutt, D.A.⁵

12
- 72549094049
- A Paul AA Kodentsov FJJ Van Loo 2004 Z. Metallkd. 95 317
- (2004) Z. Metallkd. , vol.95 , pp. 317
- Paul, A.¹ Kodentsov, A.A.² Van Loo, F.J.J.³

13
- 44449105957
- 10.1016/j.scriptamat.2008.03.031 1:CAS:528:DC%2BD1cXmsFantL8%3D
- PJ Shang ZQ Liu DX Li JK Shang 2008 Scripta Mater. 59 317 10.1016/j.scriptamat.2008.03.031 1:CAS:528:DC%2BD1cXmsFantL8%3D
- (2008) Scripta Mater. , vol.59 , pp. 317
- Shang, P.J.¹ Liu, Z.Q.² Li, D.X.³ Shang, J.K.⁴

14
- 44449179529
- E Jonew 1927 Philos. Mag. 4 1302
- (1927) Philos. Mag. , vol.4 , pp. 1302
- Jonew, E.¹

15
- 0000534554
- 1:CAS:528:DyaG1MXht1Sqsbk%3D
- W Burkhardt K Schubert 1959 Z. Metallkd. 50 442 1:CAS:528: DyaG1MXht1Sqsbk%3D
- (1959) Z. Metallkd. , vol.50 , pp. 442
- Burkhardt, W.¹ Schubert, K.²

16
- 34848872225
- 5 scallop-type grains and Cu substrate in reactions between molten Sn-based solders and Cu
- DOI 10.1063/1.2776002
- JO Suh KN Tu N Tamura 2007 J. Appl. Phys. 102 063511 10.1063/1.2776002 2007JAP...102f3511S (Pubitemid 47508924)
- (2007) Journal of Applied Physics , vol.102 , Issue.6 , pp. 063511
- Suh, J.O.¹ Tu, K.N.² Tamura, N.³

17
- 0020125253
- KINETICS OF INTERFACIAL REACTION IN BIMETALLIC Cu-Sn THIN FILMS.
- DOI 10.1016/0001-6160(82)90201-2
- KN Tu R Thompson 1982 Acta Metall. 30 947 10.1016/0001-6160(82)90201-2 1:CAS:528:DyaL38Xit1equ7c%3D (Pubitemid 12513516)
- (1982) Acta Metallurgica , vol.30 , Issue.5 , pp. 947-952
- Tu, K.N.¹ Thompson, R.D.²

18
- 0029223405
- 1:CAS:528:DyaK2MXjtFKltr8%3D
- S Bader W Gust H Hieber 1995 Acta Metall. Mater. 43 329 1:CAS:528:DyaK2MXjtFKltr8%3D
- (1995) Acta Metall. Mater. , vol.43 , pp. 329
- Bader, S.¹ Gust, W.² Hieber, H.³

* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.