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Volumn 85, Issue 2, 2008, Pages 327-331
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Characterization of polymer matrix and low melting point solder for anisotropic conductive film
a
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Author keywords
Anisotropic conductive film; High reliability; Low melting point solder
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Indexed keywords
ANISOTROPY;
BRAZING;
CONDUCTIVE FILMS;
DIFFERENTIAL SCANNING CALORIMETRY;
DIGITAL CAMERAS;
HYDRODYNAMICS;
LASER INTERFEROMETRY;
MATRIX ALGEBRA;
MELTING;
POLYMER MATRIX;
POLYMERS;
RHEOLOGY;
STEELMAKING;
SURFACE TREATMENT;
THERMOCHEMISTRY;
VISCOMETERS;
VISCOSITY;
WELDING;
AIR ENVIRONMENTS;
ANISOTROPIC CONDUCTIVE FILM (ACF);
CURING CONDITIONS;
DIFFERENTIAL SCANNING CALORIMETRY (PHOTO-DSC);
DYNAMIC MECHANICAL ANALYZER (DMA);
ELECTRICAL INTERCONNECTIONS;
LOW MELTING POINT;
MATERIAL CHARACTERIZATIONS;
MELTING TEMPERATURE (TM);
OXIDE LAYERS;
POLYMER SYSTEMS;
PROCESSING CYCLES;
REACTION TEMPERATURES;
REDUCTANT;
MELTING POINT;
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EID: 47049108319
PISSN: 01679317
EISSN: None
Source Type: Journal
DOI: 10.1016/j.mee.2007.07.005 Document Type: Article |
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Times cited : (64)
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References (7)
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