Ultrathin Cr added Ru film as a seedless Cu diffusion barrier for advanced Cu interconnects

Applied Surface Science

Volumn 258, Issue 18, 2012, Pages 7225-7230

  Hsu, Kuo Chung ^a   Perng, Dung Ching ^a   Yeh, Jia Bin ^a   Wang, Yi Chun ^a  

^a NATIONAL CHENG KUNG UNIVERSITY   (Taiwan)

Author keywords

Cu interconnect; Cu metallization; Diffusion barrier; RuCr alloy

Indexed keywords

AMORPHOUS FILMS; BINARY ALLOYS; CHROMIUM; COPPER; ELECTRIC FIELDS; HIGH RESOLUTION TRANSMISSION ELECTRON MICROSCOPY; INTEGRATED CIRCUIT INTERCONNECTS; METALLIZING; RUTHENIUM; X RAY DIFFRACTION; X RAY PHOTOELECTRON SPECTROSCOPY;

AMORPHOUS-LIKE; CU DIFFUSION BARRIER; CU INTERCONNECT; CU METALLIZATION; CU-INTERCONNECTS; ORDERS OF MAGNITUDE; STACKED STRUCTURE; XRD PATTERNS;

DIFFUSION BARRIERS;

EID: 84861095951     PISSN: 01694332     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.apsusc.2012.04.046     Document Type: Article

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