Physical, electrical, and reliability characterization of Ru for Cu interconnects

2006 International Interconnect Technology Conference, IITC

Volumn , Issue , 2006, Pages 187-190

  Yang, C C ^a   Spooner, T ^a   Ponoth, S ^a   Chanda, K ^a   Simon, A ^a   Lavoie, C ^b   Lane, M ^b   Hu, C K ^b   Liniger, E ^b   Gignac, L ^b   Shaw, T ^b   Cohen, S ^b   McFeely, F ^b   Edelstein, D ^b  

^a IBM RESEARCH   (United States)

^b IBM T J WATSON RESEARCH CENTER   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

BACK-END OF LINE; BI LAYERS; BREAKDOWN TESTS; CHEMICAL VAPORS; CU INTERCONNECTS; CURRENT-VOLTAGE; DUAL DAMASCENE; ELECTRICAL PERFORMANCES; ELECTROMIGRATION (EM); INTERNATIONAL INTERCONNECT TECHNOLOGY CONFERENCE; LOW-K INTEGRATION; RELIABILITY CHARACTERIZATION; THIN-FILM CHARACTERIZATION; VOLTAGE SWEEP; X-RAY DIFFRACTION;

COPPER; COPPER ALLOYS; METALLIZING; OPTICAL INTERCONNECTS; TECHNOLOGY; THICK FILMS; VAPORS; X RAY ANALYSIS;

CHEMICAL VAPOR DEPOSITION;

EID: 50249098204     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/IITC.2006.1648684     Document Type: Conference Paper

References (10)

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4. C.-C. Yang, et al., IEEE Im. Interconnect Technology Conf., 7.7 (2005)
5. C. Ryu, et al., IEEE Trans. Elec. Dev. 46, 1113 (1999)
6. M. Lane et al., Appl. Phys. Letters, 83, n12, 2330 (2003)
7. M. Lane et al., Mat. Res. Soc. Symp. Proc., 766, 153 (2003)
8. H. Kim, et al., MRS Adv. Metallization Conf., 551 (2005)
9. Moffatt's Handbook of Binary Phase Diagrams, edited by J. Westbrook, Genium Publishing Corp. (1984)
10. C. Cabral , Jr., C. Lavoie, J.M.E. Harper, J. Jordan-Sweet, Thin Solid Films 397, 194(2001)