Isothermal aging induced evolution of the material behavior of underfill encapsulants

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2009, Pages 134-149

  Lin, Chang ^a   Suhling, Jeffrey C ^a   Lall, Pradeep ^a  

^a AUBURN UNIVERSITY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

AGING EFFECTS; AGING TEMPERATURES; AGING TIME; CREEP BEHAVIORS; CREEP STRAIN RATE; CREEP TESTS; ELECTRONIC PACKAGING; EMPIRICAL MODEL; ENCAPSULANTS; ENVIRONMENTAL EXPOSURE; FLIP CHIP; FLIP CHIP ASSEMBLIES; HARSH ENVIRONMENT; HIGHER TEMPERATURES; ISOTHERMAL AGING; ISOTHERMAL EXPOSURES; MATERIAL BEHAVIOR; MATERIAL PROPERTY; MECHANICAL BEHAVIOR; MICRO-SCALES; NOVEL METHODS; QUALIFICATION TEST; STRESS-STRAIN; UNDERFILL ENCAPSULANTS; UNDERFILL MATERIALS; UNDERFILLS; UNIAXIAL TESTS;

CHIP SCALE PACKAGES; CREEP; CREEP TESTING; ELECTRONIC EQUIPMENT MANUFACTURE; MATERIALS; SILICA; SPECIMEN PREPARATION; TENSILE TESTING; THERMAL CYCLING; TORSION TESTING;

STRAIN RATE;

EID: 70349678321     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2009.5074007     Document Type: Conference Paper

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