Moisture and temperature effects on the Reliability of interfacial adhesion of a polymer/metal interface

Proceedings - Electronic Components and Technology Conference

Volumn 2, Issue , 2004, Pages 1752-1758

  Ferguson, Timothy P ^a   Qu, Jianmin ^a  

^a GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

INTERFACIAL ADHESION; INTERFACIAL FRACTURE; METAL INTERFACES; MOISTURE EXPOSURE;

ADHESION; ASSEMBLY; CRACKS; ELASTIC MODULI; INTERFACES (MATERIALS); MICROELECTRONICS; MOISTURE; OXIDATION; RELIABILITY; SILICON; SURFACE CHEMISTRY; THERMAL EFFECTS; TOUGHNESS; X RAY PHOTOELECTRON SPECTROSCOPY;

POLYMERS;

EID: 10444231151     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

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