Characterization of the Viscoelasticity of Molding Compounds in the Time Domain

Journal of Electronic Materials

Volumn 39, Issue 4, 2010, Pages 419-425

  Chae, Seung Hyun ^a   Zhao, Jie Hua ^b   Edwards, Darvin R ^b   Ho, Paul S ^a  

^a The University of Texas at Austin   (United States)

^b TEXAS INSTRUMENTS   (United States)

Author keywords

Master curve; Molding compound; Prony series; Stress relaxation; Viscoelasticity

Indexed keywords

EXPERIMENTAL DATA; FREQUENCY DOMAINS; INTRINSIC CHARACTERISTICS; MASTER CURVE; MICROELECTRONICS PACKAGING; MOLDING COMPOUND; POLYMER-BASED MATERIALS; POLYMERIC MATERIAL; PRONY SERIES; REFERENCE TEMPERATURE; RELAXATION BEHAVIORS; RELAXATION MODULUS; SHIFT FACTORS; SIMPLE MODEL; STRESS MODELS; TIME DOMAIN; TIME-TEMPERATURE EQUIVALENCE; VISCOELASTIC BEHAVIORS; VISCOELASTIC PROPERTIES;

ELASTICITY; MICROELECTRONICS; MOLDING; PACKAGING MATERIALS; POLYMER BLENDS; POLYMERS; RESIDUAL STRESSES; SHEET MOLDING COMPOUNDS; STRESS RELAXATION; TIME DOMAIN ANALYSIS; VISCOELASTICITY; VISCOSITY;

MATERIALS PROPERTIES;

EID: 77951023098     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-010-1078-7     Document Type: Article

References (18)

1. WF van den Bogert DJ Belton MJ Molter DS Soane RW Biernath 1988 IEEE Trans. Compon. Hybr. 11 245 10.1109/33.16648
2. RH Krondorfer YK Kim 2007 IEEE Trans. Compon. Packag. Technol. 30 285 10.1109/TCAPT.2007.898360 1:CAS:528:DC%2BD2sXnsVShu7w%3D (Pubitemid 46864858)
3. J. de Vreugd, K.M.B. Jansen, A. Xiao, L.J. Ernst, C. Bohm, A. Kessler, H. Preu, and M. Stecher, Proceedings of the 58th Electronic Components and Technology Conference (Orlando, FL: IEEE, 2008), pp. 1635-1640.
4. LJ Ernst GQ Zhang KMB Jansen HJL Bressers 2003 J. Electron. Packag. 125 539 10.1115/1.1604156 1:CAS:528:DC%2BD3sXpvFOmsb8%3D
5. J.D. Ferry, Viscoelastic Properties of Polymers, 3rd ed. (New York: Wiley, 1980).
6. N.W. Tschoegl, The Phenomenological Theory of Linear Viscoelastic Behavior: An Introduction (Berlin: Springer-Verlag, 1989).
7. RA Schapery SW Park 1999 Int. J. Solids Struct. 36 1677 0946.74012 10.1016/S0020-7683(98)00060-2
8. Y He 2005 Thermochim. Acta 439 127 10.1016/j.tca.2005.09.016 1:CAS:528:DC%2BD2MXht1GlsrnF (Pubitemid 41688362)
9. W.N. Findley, J.S. Lai, and K. Onaran, Creep and Relaxation of Nonlinear Viscoelastic Materials (Mineola, NY: Dover, 1989).
10. M. Amagai, Y. Suzuki, K. Abe, Y. Kim, and H. Sano, Proceedings of the 58th Electronic Components and Technology Conference (Orlando, FL: IEEE, 2008), pp. 1445-1452.
11. M. Ward and D.W. Hadley, An Introduction to the Mechanical Properties of Solid Polymers (Chichester, UK: Wiley, 1993), Ch. 6.
12. BD Harper 1994 J. Electon. Packag. 116 191 10.1115/1.2905685
13. VH Kenner BD Harper VY Itkin 1997 J. Electron. Mater. 26 821 10.1007/s11664-997-0257-7 1:CAS:528:DyaK2sXksVSltLs%3D 1997JEMat..26..821K
14. S. Park and C. Feger, Proceedings of the 58th Electronic Components and Technology Conference (Orlando, FL: IEEE, 2008), pp. 913-917.
15. W Brostow 1985 Mater. Chem. Phys. 13 47 10.1016/0254-0584(85)90026-4 1:CAS:528:DyaL2MXlsVamu7g%3D (Pubitemid 15529216)
16. D Holmes F Jing 1994 J. Phys. D Appl. Phys. 27 2475 10.1088/0022-3727/27/ 12/006 1:CAS:528:DyaK2MXislSmu7g%3D 1994JPhD...27.2475H
17. ASTM D6048-07, Standard Practice for Stress Relaxation Testing of Raw Rubber, Unvulcanized Rubber Compounds, and Thermoplastic Elastomers. ASTM International (2007).
18. S. Imaoka, Sheldon's ANSYS Tips on Viscoelasticity (2008). Available from http://ansys.net.