Elastic modulus variation due to moisture absorption and permanent changes upon redrying in an epoxy based underfill

IEEE Transactions on Components and Packaging Technologies

Volumn 29, Issue 1, 2006, Pages 105-111

  Ferguson, Timothy P ^a   Qu, Jianmin ^b  

^a SOUTHERN RESEARCH INSTITUTE   (United States)

^b GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

Absorption; Degradation; Elastic modulus; Epoxy resin; Irreversible damage; Moisture; Recovery; Temperature

Indexed keywords

ABSORPTION; DRYING; ELASTIC MODULI; EPOXY RESINS; HYDROLYSIS; MOISTURE; SATURATION (MATERIALS COMPOSITION);

IRREVERSIBLE DAMAGE; MOISTURE PRECONDITIONING; MOISTURE SATURATION; PLASTICIZATION; UNDERFILL;

SOLDERED JOINTS;

EID: 33644795902     PISSN: 15213331     EISSN: None     Source Type: Journal    
DOI: 10.1109/TCAPT.2005.853172     Document Type: Article

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