Time-dependent material modeling for finite element analyses of flip chips

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2000, Pages 1548-1553

  Feustel, Frank ^a   Wiese, Steffen ^a   Meusel, Ekkehard ^a  

^a DRESDEN UNIVERSITY OF TECHNOLOGY   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER SIMULATION; DEFORMATION; FINITE ELEMENT METHOD; PLASTICITY; RELIABILITY; SOLDERING ALLOYS; TENSILE TESTING; THERMAL CYCLING; THERMAL EFFECTS; TIN ALLOYS; VISCOELASTICITY;

EUTECTIC SOLDER; FLIP CHIP JOINTS; LINEAR ELASTICITY; LINEAR VISCOELASTICITY; TIME DEPENDENT MATERIAL;

FLIP CHIP DEVICES;

EID: 0034476047     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (9)