Measurement of the temperature dependent constitutive behavior of underfill encapsulants

IEEE Transactions on Components and Packaging Technologies

Volumn 28, Issue 3, 2005, Pages 467-476

  Islam, M Saiful ^a   Suhling, Jeffrey C ^a   Lall, Pradeep ^a  

^a AUBURN UNIVERSITY   (United States)

Author keywords

Elastic modulus; Flip chip; Material properties; Mechanical behavior; Mechanical testing; Stress strain curves; Underfill

Indexed keywords

CAPILLARY FLOW; ELASTIC MODULI; ENCAPSULATION; FLIP CHIP DEVICES; MATHEMATICAL MODELS; MECHANICAL PROPERTIES; MECHANICAL TESTING; STRAIN RATE; THERMAL STRESS;

MATERIAL PROPERTIES; MECHANICAL BEHAVIOR; STRESS-STRAIN CURVE; UNDERFILL;

CHIP SCALE PACKAGES;

EID: 27644526672     PISSN: 15213331     EISSN: None     Source Type: Journal    
DOI: 10.1109/TCAPT.2005.854301     Document Type: Article

References (8)

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