Electrical characterization of screen-printed circuits on the fabric

IEEE Transactions on Advanced Packaging

Volumn 33, Issue 1, 2010, Pages 196-205

  Kim, Yongsang ^a   Kim, Hyejung ^a   Yoo, Hoi Jun ^a  

^a Korea Advanced Institute of Science and Technology (KAIST)   (South Korea)

Author keywords

E textile; Electrical characterization of fabric; Fabric; Packaging; Planar fashionable circuit board (P FCB); Silk screen printing; Sputtering; Transmission lines; Wearable computing

Indexed keywords

CIRCUIT BOARDS; E-TEXTILE; ELECTRICAL CHARACTERIZATION; ELECTRICAL CHARACTERIZATION OF FABRIC; PLANAR-FASHIONABLE CIRCUIT BOARD (P-FCB); SILK-SCREEN PRINTING; TRANSMISSION LINE; WEARABLE COMPUTING;

APPLICATION SPECIFIC INTEGRATED CIRCUITS; BANDPASS FILTERS; CAPACITANCE; CAPACITORS; CHIP SCALE PACKAGES; ELECTRIC LINES; ELECTRIC NETWORK ANALYSIS; ELECTRIC RESISTANCE; ELECTRONIC EQUIPMENT MANUFACTURE; FLIP CHIP DEVICES; MECHANICAL PROPERTIES; PRINTED CIRCUITS; PRINTING PRESSES; SCREEN PRINTING; SILK; TEXTILE PROCESSING; TRANSMISSION LINE THEORY; WEARABLE COMPUTERS;

FABRICS;

EID: 77949275831     PISSN: 15213323     EISSN: None     Source Type: Journal    
DOI: 10.1109/TADVP.2009.2034536     Document Type: Article

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