Thermomechanical analysis of film-on-substrate system with temperature-dependent properties

Journal of Applied Mechanics, Transactions ASME

Volumn 77, Issue 4, 2010, Pages 1-9

  Huang, YongAn ^a   Yin, ZhouPing ^a   Xiong, YouLun ^a  

^a HUAZHONG UNIVERSITY OF SCIENCE AND TECHNOLOGY   (China)

Author keywords

Elastomer; Flexible electronics; Multiphysics simulation; Thermomechanical buckling; Thin film

Indexed keywords

CRITICAL STRAINS; FINITE ELEMENT SIMULATIONS; HALF-SPACE; LOCAL BUCKLING; MULTIPHYSICS SIMULATIONS; POLYDIMETHYLSILOXANE PDMS; SEMI-ANALYTICAL SOLUTION; STRESS/STRAIN; SUBSTRATE SYSTEM; TEMPERATURE EFFECTS; TEMPERATURE-DEPENDENT PROPERTIES; THERMO-MECHANICAL ANALYSIS; THERMOMECHANICAL BUCKLING; WORKING TEMPERATURES;

BUCKLING; RUBBER; SENSITIVITY ANALYSIS; SILICONES; SUBSTRATES; THIN FILMS;

FLEXIBLE ELECTRONICS;

EID: 77955247256     PISSN: 00218936     EISSN: 15289036     Source Type: Journal    
DOI: 10.1115/1.4000927     Document Type: Article

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