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Volumn 88, Issue 1, 2006, Pages
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Thermomechanical criteria for overlay alignment in flexible thin-film electronic circuits
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Author keywords
[No Author keywords available]
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Indexed keywords
FILM DEPOSITION;
OVERLAY ALIGNMENT;
PHOTOMASKS;
THIN-FILM ELECTRONIC CIRCUITS;
DEPOSITION;
FILM GROWTH;
SUBSTRATES;
TENSILE STRESS;
THIN FILMS;
NETWORKS (CIRCUITS);
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EID: 33645531090
PISSN: 00036951
EISSN: None
Source Type: Journal
DOI: 10.1063/1.2161391 Document Type: Article |
Times cited : (24)
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References (4)
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