Stretchable" electronics: Does one really need a good thermal expansion (contraction) match between the silicon die and the plastic carrier?

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2009, Pages 713-719

  Suhir, E ^a,b,c  

^a UNIVERSITY OF CALIFORNIA   (United States)

^b UNIVERSITY OF MARYLAND   (United States)

^c ERS CO   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CARRIER MATERIAL; COMBINED ACTIONS; DEVELOPED MODEL; ELEVATED TEMPERATURE; EXPERIMENTAL SETUP; EXTERNAL LOADING; INDUCED STRESS; INTERFACIAL STRESS; MECHANICAL LOADING; PHYSICAL DESIGN; PLASTIC CARRIERS; SILICON DIE; STRESS IN THE DIE; STRESS MODELS; STRESS/STRAIN; TENSILE LOADS; TEST DATA;

DIES; GAGES; MODELS; STRESS RELIEF; THERMAL STRESS;

THERMAL EXPANSION;

EID: 70349680439     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2009.5074091     Document Type: Conference Paper

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