Thermomechanical analysis of thin films on temperature-dependent elastomeric substrates in flexible heterogeneous electronics

Thin Solid Films

Volumn 518, Issue 6, 2010, Pages 1698-1702

  Huang, Yongan ^a   Yin, Zhouping ^a   Xiong, Youlun ^a  

^a HUAZHONG UNIVERSITY OF SCIENCE AND TECHNOLOGY   (China)

Author keywords

Elastomeric substrate; Flexible electronics; Thermomechanical modeling; Thin films; Young's modulus

Indexed keywords

CONTINUUM MODEL; ELASTOMERIC SUBSTRATES; HETEROGENEOUS STRUCTURES; INORGANIC/ORGANIC; STRAIN MODEL; SUBSTRATE STRUCTURE; TECHNOLOGICAL PARAMETERS; TEMPERATURE DEPENDENT; TEMPERATURE EFFECTS; TEMPERATURE-DEPENDENT EFFECTS; THERMAL ACTIONS; THERMAL MANAGEMENT; THERMO-MECHANICAL ANALYSIS; THERMOMECHANICAL MODELING; YOUNG'S MODULUS;

COMPUTER CRIME; CONTINUUM MECHANICS; ELASTIC MODULI; ELASTICITY; SENSITIVITY ANALYSIS; STRAIN; STRUCTURAL DESIGN; SUBSTRATES; THIN FILMS;

FLEXIBLE ELECTRONICS;

EID: 73449140784     PISSN: 00406090     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.tsf.2009.11.077     Document Type: Article

References (30)

1. Kim D.-H., Ahn J.-H., Choi W.M., Kim H.-S., Kim T.-H., Song J., Huang Y.Y., Liu Z., Lu C., and Rogers J.A. Science 320 (2008) 507
2. Reuss R.H., Chalamala B.R., Moussessian A., Kane M.G., Kumar A., Zhang D.C., Rogers J.A., Hatalis M., Temple D., Moddel G., Eliasson B.J., Estes M.J., Kunze J., Handy E.S., Harmon E.S., Salzman D.B., Woodall J.M., Alam M.A., Murthy J.Y., Jacobsen S.C., Olivier M., Markus D., Campbell P.M., and Snow E. Proc. IEEE 93 (2005) 1239
3. Khang D.-Y., Jiang H., Huang Y., and Rogers J.A. Science 311 (2006) 208
4. Lee J.B., and Subramanian V. IEEE Trans. Electron Devices 52 (2005) 269
5. Li L., Ling Q.D., Lim S.L., Tan Y.P., Zhu C., Chan D.S.H., Kang E.T., and Neoh K.-G. Org. Electron. 8 (2007) 401
6. Niggemann M., Zimmermann B., Haschke J., Glatthaar M., and Gombert A. Thin Solid Films 516 (2008) 7181
7. Tavares C.J., Marques S.M., Rebouta L., Lanceros-Mendez S., Sencadas V., Costa C.M., Alves E., and Fernandes A.J. Thin Solid Films 517 (2008) 1161
8. Wagner S., Gleskova H., Cheng I.C., and Wu M. Thin Solid Films 430 (2003) 15
9. Khang D.Y., Jiang H., Huang Y., and Rogers J.A. Science 311 (2006) 208
10. Jiang H., Khang D.Y., Song J., Sun Y., Huang Y., and Rogers J.A. Proc. Natl. Acad. Sci. 104 (2007) 15607
11. Lacour S.P., Chan D., Wagner S., Li T., and Suo Z. Appl. Phys. Lett. 88 (2006) 204103
12. Huang Z.Y., Hong W., and Suo Z. J. Mech. Phys. Solids 53 (2005) 2101
13. Kim T.H., Choi W.M., Kim D.H., Meitl M.A., Menard E., Jiang H., Carlisle J.A., and Rogers J.A. Adv. Mater. 20 (2008) 2171
14. Sun Y., Choi W.M., Jiang H., Huang Y.Y., and Rogers J.A. Nat. Nanotechnol. 1 (2006) 201
15. Jiang H., Sun Y., Rogersc J.A., and Huang Y. Int. J. Solids Struct. 45 (2008) 2014
16. Wagner S., Lacour S.P., Jones J., Hsu P.-h.I., Sturm J.C., Li T., and Suo Z. Phys. E: Low-Dimens. Syst. Nanostruct. 25 (2004) 326
17. Gleskova H., Cheng I.C., Wagner S., Sturm J.C., and Suo Z. Sol. Energy 80 (2006) 687
18. Jiang H., Khang D.-Y., Song J., Sun Y., Huang Y., and Rogers J.A. Proc. Natl. Acad. Sci. 104/40 (2007) 15607
19. Kim D.H., Ahn J.H., Choi W.M., Kim H.S., Kim T.H., Song J., Huang Y.Y., Liu Z., Lu C., and Rogers J.A. Science 320 (2008) 507
20. Lacour S.P., Jones J., Wagner S., Li T., and Suo Z. Proc. IEEE 93 (2005) 1459
21. Lacour S.P., Wagner S., Huang Z., and Suo Z. Appl. Phys. Lett. 82 (2003) 2404
22. Gleskova H., Cheng I.-C., Wagner S., and Suo Z. Appl. Phys. Lett. 88 (2006) 011905
23. Li Y., and Huo Y. Thin Solid Films 517 (2009) 2691
24. Fuard D., Tzvetkova-Chevolleau T., Decossas S., Tracqui P., and Schiavone P. Microelectron. Eng. 85 (2008) 1289
25. Quake S.R., and Scherer A. Science 290 (2000) 1536
26. Chen X., and Hutchinson J.W. J. Appl. Mech. (Trans. ASME) 71 (2004) 597
27. Suo Z., Vlassak J., and Wagner S. China Particuology 3 (2005) 321
28. Wang S., Song J., Kim D.H., Huang Y., and Rogers J.A. Appl. Phys. Lett. 93 (2008) 023126
29. Suo Z., Ma E.Y., Gleskova H., and Wagner S. Appl. Phys. Lett. 74 (1999) 1177
30. Yang M.H., Huang W.J., Chien T.C., Chen C.M., Chang H.Y., Chang Y.S., and Chou C.Y. Polymer 42 (2001) 8841